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OEM 1-8 Layer PCB Board With Copper Clad Laminate Immersion Gold PCB

Size: 2mm~200mm

Min Line Width/Spacing: 0.1mm

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Advanced Thermal Conductivity Ceramic PCB Board Immersion Gold

Product Type: PCB&PCBAOEM,DFM

Dielectric Constant: 6.0-10.0

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DFM Multilayer Ceramic PCB With Immersion Gold Technology Enig Finish Temp Resistant

Pcb Name: Immersion Gold Ceramic PCB Board

Surface Finished: Immersion Gold,nickel-palladium GLOD

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Thickness 0.1mm to 3.0mm Ceramic Copper Clad PCB Featuring Size Range 2mm to 200mm Perfect for High Reliability Circuits

Substratetype: Ceramic

Application Segment: Auto,Industrial,Medical,DataCom、Comsumer

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ENIG Surface Ceramic PCB Board Min Line 0.1mm Temp Range -50.C To 150.C

Product Type: PCB&PCBAOEM,DFM

Min Line Width/Spacing: 0.1mm

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Wear Resistant Ceramic PCB Board With DFM And High Thermal Conductivity

Min Line Width/Spacing: 0.1mm

Service: One-stop Service / OEM,DFM

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1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board

Substrate Type: Rigid

Minimum Hole Size: 0.2mm

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OEM ODM Ceramic PCB Board With Black Solder Mask High Dielectric Constant

Min Line Width/Spacing: 0.1mm

Service: One-stop Service / OEM,DFM

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High Thermal Conductivity Ceramic PCBs Al2O3 ALN Immersion Gold Finish

Operating Temperature: -50°C To 150°C

Surface Finished: Immersion Gold,nickel-palladium GLOD

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22mm*19mm Black Ceramic PCB Board With Thermal Conductivity Al2O3/ALN

Layers: 1-8 Layers

Thermal Conductivity: 170 W/mK

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100 Percent E Testing Ceramic Substrate PCB UL Certified Ensuring High Precision and Control in Electronic Manufacturing

Surfacefinish: ENIG, HASL, Gold Plating

Layercount: 1-4 Layers

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Item No R0028 Ceramic PCB Board Ceramic Thickfilm PCB Offering 1.6 MM Thickness Designed for Robust Electronic Components

Pcb Thickness: 1.6 MM

Item No: R0028

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Black Solder Mask Ceramic PCB Board Manufacturing One Stop Service

Thermal Conductivity: 170 W/mK

Solder Mask Colour: Black

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Green ENIG Surface Finish Ceramic IC Substrate PCB Dual Layered With 0.1mm Trace

Rohs Compliant: Yes

Minimum Trace Width: 0.1mm

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Two Layer Rigid IC Substrate PCB 0.2mm ENIG Surface Finish RoHS Compliant

Thickness: 0.2mm

Rohs Compliant: Yes

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Durable Density Ceramic IC Substrate PCB Ultra Thin 0.2mm 0.1mm Trace Materials BT

Minimum Trace Spacing: 0.1mm

Substrate Type: Rigid

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OEM Precision Ceramic Multilayer PCB With 0.1mm Min Line Immersion Gold Surface

ENIG IPC4552 Surface Double Sided Circuit Board 2 Layer PCB Board For Car Audio

ENIG Surface Finish IC Substrate PCB IC Circuit Board 0.2mm Basic material BT HF HTG

1-8Layer Immersion Gold Ceramic PCB Board Al2O3/ALN Dielectric Constant

OEM 1-8 Layer PCB Board With Copper Clad Laminate Immersion Gold PCB

Advanced Thermal Conductivity Ceramic PCB Board Immersion Gold

DFM Multilayer Ceramic PCB With Immersion Gold Technology Enig Finish Temp Resistant

Thickness 0.1mm to 3.0mm Ceramic Copper Clad PCB Featuring Size Range 2mm to 200mm Perfect for High Reliability Circuits

ENIG Surface Ceramic PCB Board Min Line 0.1mm Temp Range -50.C To 150.C

Wear Resistant Ceramic PCB Board With DFM And High Thermal Conductivity

1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board

OEM ODM Ceramic PCB Board With Black Solder Mask High Dielectric Constant

High Thermal Conductivity Ceramic PCBs Al2O3 ALN Immersion Gold Finish

22mm*19mm Black Ceramic PCB Board With Thermal Conductivity Al2O3/ALN

100 Percent E Testing Ceramic Substrate PCB UL Certified Ensuring High Precision and Control in Electronic Manufacturing

Item No R0028 Ceramic PCB Board Ceramic Thickfilm PCB Offering 1.6 MM Thickness Designed for Robust Electronic Components

Black Solder Mask Ceramic PCB Board Manufacturing One Stop Service

Green ENIG Surface Finish Ceramic IC Substrate PCB Dual Layered With 0.1mm Trace

Two Layer Rigid IC Substrate PCB 0.2mm ENIG Surface Finish RoHS Compliant

Durable Density Ceramic IC Substrate PCB Ultra Thin 0.2mm 0.1mm Trace Materials BT