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0.2mm-6.0mm Thickness Multilayer PCB Board with Multiclass Impedance and Copper Thickness 0.5oz-6oz

Max. Panel Size: 600mm*1200mm

Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP

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Gold Finger Multilayer Circuit Board with 0.2mm Min. Hole Size and OSP Surface

Packing: Vacuum Packing With Carton Box

Size: /

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4-32 Layers Multilayer Printed Circuit Board and Thickness 0.2mm-6.0mm for Advanced Applications

Number Of Layers: 4-32 Layers

Service: One-stop Service OEM

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Max. Panel Size 600mm*1200mm Multilayer PCB Board with 12OZ Copper Weight and 4-22 Layers

Service: One-stop Service OEM

Min. Hole Size: 0.2mm

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Customizable Multilayer PCB Board with 12OZ Copper Weight and 0.2mm-6.0mm Thickness

Service: One-stop Service OEM

Thickness: 0.2mm-6.0mm

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Good price FR-4 High Density Interconnect Any Layer PCB with Minimum Hole Size of 0.1mm,Panasonic MEGTRON 7,M8,M9,Multiple lamination online video

FR-4 High Density Interconnect Any Layer PCB with Minimum Hole Size of 0.1mm,Panasonic MEGTRON 7,M8,M9,Multiple lamination

Material: FR-4

Solder Mask Color: Green, Red, Blue, Black, Yellow, White

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Customizable HDI Printed Circuit Boards with 0.15mm Minimum Hole Size and 0.4-3.2mm Thickness

Impedance Control: Yes

Testing: 100%E-Testing,X-RAY

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6-32L Board Layer HDI PCB Board Made of FR4 IT180 Raw Material and 0.1mm Laser Drill Hole Size for Applications

Key Words: High Density Interconnector

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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Multilayer Printed Circuit Board 4-32 Layers and 0.2mm Min. Hole Size for Advanced Designs

Packing: Vacuum Packing With Carton Box

Surface Mount Technology: Yes

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Multiclass Impedance Multilayer PCB Board with 4-22 Layers and 4-32 Layers Design

Copper Thickness: 0.5oz-6oz

Max. Panel Size: 600mm*1200mm

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Surface Mount Technology Yes Multilayer Circuit Board with ENIPIG Surface

Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP

Thickness: 0.2mm-6.0mm

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