Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Min. Bga Pitch: 0.3mm
Impedance Control: +/-10%
Blind Vias: Yes
Key Words: High Density Interconnector
Impedance Control: +/-10%
Bga: 10MIL
Impedance Control: +/-10%
Misalignment Of Layers: +/- 0.06
Thickness: 0.6mm
Size: 9*9cm
Product: Print Circuit Board
Minimum Hole Diameter: 0.10 Mm
Features: Gerber/PCB File Needed
Finished Copper: 1OZ
Layer Count: 16 Layers
Thickness: 0.6mm
Number Of Layers: 12-Layer
Silkscreen Color: White, Black, Yellow
Board Thickness: 0.2-6.0mm
Min. Hole Size: 0.2mm
Minimum Hole Diameter: 0.10 Mm
Min. Panel Size: 50mm X 50mm
Copper Weight: 0.25OZ~12OZ
Minimum Hole Diameter: 0.10 Mm
Samples: Available
Surface: Immersion Gold
Surface Finishing: Plated Ni/Au
Min. Silkscreen Bridge: 0.1mm
Features: Gerber/PCB File Needed
Layer Count: 16 Layers
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