Bend Radius: 0.5-10mm
Components: SMD, BGA, DIP, Etc.
Material: FR4, Polyimide, PET
Minimum Trace/Space: 0.1mm
Max Layer: 52L
Pcb Layer: 1-28layers
Profiling Punching: Routing, V-CUT, Beveling
Bend Radius: 0.5-10mm
Type: Ceramic Thickfilm PCB
Substratetype: Ceramic
Layer Count: 2-layer
Coverlay Colour: Green
Withstand Voltage: >3KV
Base Material: Aluminum Base,CUSTOM
Minimum Hole Diameter: 0.10 Mm
Pcba Standard: IPC-A-610E
Pcb Name: 4L 1+N+1 HDI Boards
Thickness: 0.4-3.2mm
Pcb Name: 4L 1+N+1 HDI Boards
Key Words: High Density Interconnector
Raw Material: FR4 IT180
Layer Count: 4-20 Layers
Pcb Name: 4L 1+N+1 HDI Boards
Special Requirements: Lamp Socket
Thickness: 0.2mm-6.0mm
Layers: 4-22 Layer
Size: /
Copper Thickness: 0.5oz-6oz
Layer Count: 4-20 Layers
Hole Size: 0.1mm Laser Drill
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Aspect Ratio: 10:1
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