Substratetype: Ceramic
Surfacefinish: ENIG, HASL, Gold Plating
Dielectricconstant: 7-9
Substratetype: Ceramic
Copperthickness: 18µm - 105µm
Item No: R0028
Surfacefinish: ENIG, HASL, Gold Plating
Application: High Power Electronics, LED Lighting, RF Modules
Substratetype: Ceramic
Application Segment: Auto,Industrial,Medical,DataCom、Comsumer
Pcb Thickness: 1.6 MM
Item No: R0028
Surfacefinish: ENIG, HASL, Gold Plating
Layercount: 1-4 Layers
Copperthickness: 18µm - 105µm
Size: 2mm~200mm
Productname: Ceramic PCB Board
Certificates: ISO9001,ISO14001,IATF16949,UL
Type: Ceramic Thickfilm PCB
Substratetype: Ceramic
Copper: 1oz
Glass Epoxy: RO4730G3 0.762mm
Material: Rogers
Number Of Layers: 2 Layer, Multilayer, Hybrid PCB
Glass Epoxy: RO4730G3 0.762mm
Test: 100% Electrical Test Prior Shipment
Thermal Conductivity: 0.24W/m-K
Application: E-car
Dielectric Constant: 3.48
Material: Rogers
Glass Epoxy: RO4730G3 0.762mm
Board Thickness: 0.78mm
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