Sample: Avaliable
Thermal Conductivity: 0.5/1/2/3/5/8 W,1.0w,>=1.0W/mK
Layer Count: 2-16 Layers
Sample: Avaliable
Min. Bga Pitch: 0.3mm
Impedance Control: +/-10%
Blind Vias: Yes
Key Words: High Density Interconnector
Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Impedance Control: +/-10%
Bga: 10MIL
Impedance Control: +/-10%
Misalignment Of Layers: +/- 0.06
Samples: Available
Surface: Immersion Gold
Product: Print Circuit Board
Minimum Hole Diameter: 0.10 Mm
Copper Weight: 0.25OZ~12OZ
Minimum Hole Diameter: 0.10 Mm
Minimum Hole Diameter: 0.10 Mm
Min. Panel Size: 50mm X 50mm
Layer Count: 16 Layers
Thickness: 0.6mm
Features: Gerber/PCB File Needed
Finished Copper: 1OZ
Thickness: 0.6mm
Size: 9*9cm
Features: Gerber/PCB File Needed
Layer Count: 16 Layers
Min Line Space: 8mil
Processing: Assembly
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