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1.0w Thermal Conductivity Insulation Sheet Ventec Metal PCB for Thermal Management

Sample: Avaliable

Thermal Conductivity: 0.5/1/2/3/5/8 W,1.0w,>=1.0W/mK

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Insulation Sheet IMS PCB 2-16 Layers for and Performance

Layer Count: 2-16 Layers

Sample: Avaliable

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High Aspect Ratio 10 1 HDI PCB Board with P1.5 Spacing and 0.3mm Min. Bga Pitch

Blind Vias: Yes

Key Words: High Density Interconnector

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100% Electrical Test Prior Shipment High Density Model Board with 10 1 Aspect Ratio

Impedance Control: +/-10%

Misalignment Of Layers: +/- 0.06

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High Speed PCB Board Blind Vias Yes Spacing P1.5 and Speed Manufacturing for Your Production Line

Test: 100% Electrical Test Prior Shipment

Bga: 10MIL

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Multilayer Printed Circuit Board Copper 1oz Multiclass Impedance Ready for Manufacturing

Copper Weight: 0.25OZ~12OZ

Minimum Hole Diameter: 0.10 Mm

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Green Solder Mask Rigid Flex PCB with FR4 Stiffener and 0.6mm Thickness Advanced Technology

Features: Gerber/PCB File Needed

Finished Copper: 1OZ

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Immersion Gold Surface Multilayer PCB Board with Red Solder Mask Color and 0.25OZ Copper Weight

Product: Print Circuit Board

Minimum Hole Diameter: 0.10 Mm

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