Sample: Avaliable
Thermal Conductivity: 0.5/1/2/3/5/8 W,1.0w,>=1.0W/mK
Layer Count: 2-16 Layers
Sample: Avaliable
Min. Bga Pitch: 0.3mm
Impedance Control: +/-10%
Blind Vias: Yes
Key Words: High Density Interconnector
Impedance Control: +/-10%
Misalignment Of Layers: +/- 0.06
Impedance Control: +/-10%
Bga: 10MIL
Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Samples: Available
Surface: Immersion Gold
Copper Weight: 0.25OZ~12OZ
Minimum Hole Diameter: 0.10 Mm
Layer Count: 16 Layers
Thickness: 0.6mm
Features: Gerber/PCB File Needed
Finished Copper: 1OZ
Features: Gerber/PCB File Needed
Layer Count: 16 Layers
Product: Print Circuit Board
Minimum Hole Diameter: 0.10 Mm
Min Line Space: 8mil
Processing: Assembly
Minimum Hole Diameter: 0.10 Mm
Min. Panel Size: 50mm X 50mm
Board Thickness: 0.2-6.0mm
Min. Hole Size: 0.2mm
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