Layers: 12 Layers
Material: TACNIC TSM-DS3
Max Layer: 32L
Minimum Trace/Space: 0.05mm
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Dimension: 41.55*131mm
Pcb Layer: 1-28layers
Product Type: PCB Assembly
Max Layer: 52L
Hole Position Deviation: ±0.05mm
Hole Position Deviation: ±0.05mm
Sanforized: Local High Density, Back Drill
Surface Finishing: HASL LF
No Of Layers: 4 Layer
No Of Layers: 4 Layer
Max Layer: 52L
Bend Radius: 0.5-10mm
Product Type: PCB Assembly
Max Layer: 52L
No Of Layers: 4 Layer
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Surface Finishing: HASL LF
Components: SMD, BGA, DIP, Etc.
Hole Position Deviation: ±0.05mm
Material: FR4, Polyimide, PET
Sanforized: Local High Density, Back Drill
Flexibility: 1-8 Times
Surface Finishing: HASL LF
Material: FR4, Polyimide, PET
Sanforized: Local High Density, Back Drill
Hole Position Deviation: ±0.05mm
Bend Radius: 0.5-10mm
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