Inner Layer Spacing: 0.15mm
Thickness: 0.4-3.2mm
Smallest Hole Size: 0.1mm
Min Via: 0.1mm
Thickness: 0.4-3.2mm
Blind And Buried Vias: Available
Blind And Buried Vias: Available
Thickness: 0.4-3.2mm
Min Trace: 3/3Mil
Pcb Thickness: 1.6mm
Min. Bga Pitch: 0.3mm
Impedance Control: +/-10%
Blind Vias: Yes
Key Words: High Density Interconnector
Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Impedance Control: +/-10%
Bga: 10MIL
Impedance Control: +/-10%
Misalignment Of Layers: +/- 0.06
Key Words: High Density Interconnector
Testing: 100%E-Testing,X-RAY
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Hole Size: 0.1mm Laser Drill
Thickness: 0.4-3.2mm
Special Requirements: Lamp Socket
Min Trace: 3/3Mil
Board Layer: 6-32L
Testing: 100%E-Testing,X-RAY
Thickness: 0.4-3.2mm
Layer Count: 4-20 Layers
Testing: 100%E-Testing,X-RAY
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