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High Density HDI PCB Board With Half Hole BGA 0.25mm Lamp Socket 10 1 Aspect Ratio

Special Request: Half Hole, 0.25mm BGA

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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20 Layer PCB Board With Multigroup Impedance Control VIPPO Under Paste TU-933

Layer Count: 4-20 Layers

Minimum Hole Size: 0.15mm

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Thickness 0.4-3.2mm HDI PCB Board 6-32L Impedance Control 100% E Testing

Key Words: High Density Interconnector

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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8mil-126mil Thickness High Density PCB HDI Circuit Board 4-20 Layers

Raw Material: FR4 IT180

Pcb Name: 4L 1+N+1 HDI Boards

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OEM HDI Circuit Board 10 Layer 2+N+2 X Ray Tested Ultra Thin 0.2mm-6.00mm

Aspect Ratio: 10:1

Minimum Hole Size: 0.15mm

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FR4 TU-872 Hight Speed PCB 10 Layers 3/3Mil PCB 4L 1 N 1 HDI Boards ENIG IP4452

Min Trace: 3/3Mil

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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6-32L HDI PCB Design 0.2mm-6.0mm Thickness Half Hole Bga Feature

Special Requirements: Lamp Socket

Aspect Ratio: 10:1

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Industrial High Density Interconnect PCB 4-20Layers 0.4-3.2mm Thickness

Minimum Hole Size: 0.15mm

Testing: 100%E-Testing,X-RAY

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6 Layers Lamp Socket HDI Rigid Flex PCB Half Hole 3/3Mil Impedance Control

Hole Size: 0.1mm Laser Drill

Special Requirements: Lamp Socket

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Durable HDI PCB Board 6-32 Layer HDI Four Sides Half Holes Laser Hole Size 0.075mm

Board Layer: 6-32L

Thickness: 0.4-3.2mm

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FR4 It180 HDI PCB Board 4-20 Layers 0.1Mm Min Hole Size ISOLA 370HR

Pcb Name: 4L 1+N+1 HDI Boards

Minimum Hole Size: 0.15mm

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Durable HDI Printed Circuit Board FR4 It180 Half Hole 0.25Mm Bga 6 Layer

Raw Material: FR4 IT180

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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Lamp Socket FR4 It180 High Density Interconnect PCB 6L 4-20 Layers

Raw Material: FR4 IT180

Impedance Control: Yes

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Blind And Burried Holes High TG PCB Cell Phone PCB ITEQ IT180 Material

Layers: 8 Layers

Material: ITEQ IT180

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Shengyi S1000 8layers HDI PCBs High Density Multilayer PCB Board BGA Solder

Layers: 8 Layers

Material: Shengyi S1000

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0.8MM Thickness Blue Solder PCB With Blind Holes For Smart Phone

Layers: 8 Layers

Material: Shengyi S1000

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HDI PCB Board

HDI PCB Board

Multilayer PCB Board

Rogers PCB Board

Rigid Flex PCB

Ceramic PCB Board

HDI Any Layer PCBs

IC Substrate PCBs

Substrate Like PCBs

Heavy Copper PCB

IMS PCB

Double Sided PCB

High Density HDI PCB Board With Half Hole BGA 0.25mm Lamp Socket 10 1 Aspect Ratio

20 Layer PCB Board With Multigroup Impedance Control VIPPO Under Paste TU-933

Thickness 0.4-3.2mm HDI PCB Board 6-32L Impedance Control 100% E Testing

8mil-126mil Thickness High Density PCB HDI Circuit Board 4-20 Layers

OEM HDI Circuit Board 10 Layer 2+N+2 X Ray Tested Ultra Thin 0.2mm-6.00mm

FR4 TU-872 Hight Speed PCB 10 Layers 3/3Mil PCB 4L 1 N 1 HDI Boards ENIG IP4452

6-32L HDI PCB Design 0.2mm-6.0mm Thickness Half Hole Bga Feature

Industrial High Density Interconnect PCB 4-20Layers 0.4-3.2mm Thickness

6 Layers Lamp Socket HDI Rigid Flex PCB Half Hole 3/3Mil Impedance Control

Durable HDI PCB Board 6-32 Layer HDI Four Sides Half Holes Laser Hole Size 0.075mm

FR4 It180 HDI PCB Board 4-20 Layers 0.1Mm Min Hole Size ISOLA 370HR

Durable HDI Printed Circuit Board FR4 It180 Half Hole 0.25Mm Bga 6 Layer

Lamp Socket FR4 It180 High Density Interconnect PCB 6L 4-20 Layers

Blind And Burried Holes High TG PCB Cell Phone PCB ITEQ IT180 Material

Shengyi S1000 8layers HDI PCBs High Density Multilayer PCB Board BGA Solder

0.8MM Thickness Blue Solder PCB With Blind Holes For Smart Phone