LT CIRCUIT CO.,LTD. Company Profile

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QC Profile

Materials Catalogue

Rogers	RO3001 RO3003 RO3006 RO3010 RO3210 RO3035 RO3206 RO4450 RO4003C RO4350B RO5880 RO5870 RO6010 RO6002 RO6006 RO6202 RO6035 TMM4 TMM6 TMM10 TMM10i DiClad 527 RO4725JXR RO4360



ISOLA	Isola FR408HR lsola Getek lsola 620 Remark: Isola all chinese factory Type have stock and lsola factory can support in time . lsola Germany factory type need purchasing it .

Arlon Nelco	POLYMIDE 35N POLYMIDE 85N AD255C AD450 AD450L POLYMIDE VT-901 F4B Nelco 4000N Nelco 7000N FR5 Nelco 4000-13 Arlon 25N Arlon 25FR AD300 AD350 AD10 AD1000 AP1000



Taconic	TLY-3 TLY-5 CER-10 TLA-34 TLC-32 TLX-8 TC350 TLF-35 RF30 RF45 RF60

Panasonic	Panasonic R775 Panasonic M4 PanasonicM6 Panasonic M7
Ventec International Group4	VT4B3 VT4B5 VT4B7 VT-47B
Ceramic	Ceramic AlN Ceramic AON 99.9% Ceramic ANO 96%
Begquist	Begquist 6 Begquist 7
TUC&EMC2	TU872 TU682
Others	5G LCP RF705S Kapton

PCB Manufacturing Capabilities

Maximum Number of Layers	32 layers (≥20 layers needs to review）
Max Size of Finish Panel	740*500mm (>600mm needs to review)
Minimum Finished Panel Size	5*5mm
Board Thickness	0.2~6.0mm (<0.2mm, >6mm needs to review)
Bow and Twist	0.2%
Rigid-Flex + HDI	2~12 layers (total layers> or layers of flex>6 needs to review)
Blind and Buried Holes Lamination Press Times	Press with same core ≤3times (>3 times needs to review)
Board thickness tolerance (No layer structure requirement)	≤1.0mm, controlled as, ±0.075 mm
	≤2.0mm, controlled as: ± 0.13 mm
	2.0~3.0mm, controlled as: ± 0.15 mm
	≥3.0mm, controlled as: ± 0.2 mm
Min Drill Hole	0.1mm (<0.15mm needs to review)
HDI Min Drill Hole	0.08-0.10mm
Aspect ratio	15:1 (＞12:1 needs to review)
Min Space in Inner Layer(one-sided)	4～8L (included): sample: 4 mil; small volume: 4.5 mil
	8~12L (included): sample: 5 mil; small volume: 5.5 mil
	12～18L (included): sample: 6 mil; small volume: 6.5 mil
Copper Thickness	Inner layer≤ 6 OZ (≥5 OZ for 4L; ≥4OZ for 6L; ≥3OZ for 8L and above shall be reviewed)
	Outer layer copper≤ 10 OZ (≥5 OZ needs to review)
	Copper in holes≤5OZ (≥1 OZ needs to review)
Reliability Test
Circuit Peel Strength	7.8N/cm
Fire Resistance	UL 94 V-0
Ionic Contamination	≤1 (unit：μg/cm2)
Min Insulation Thickness	0.05 mm (only for HOZ base copper)
Impedance Tolerance	±5Ω(<50Ω), ±10%(≥50Ω) needs to review if not this value
Inner Layer Track Width and Space
Base copper (OZ)	Track width and space (before compensation), unit: mil
	Standard Process		Advanced Process
0.3	3/3mil		Partial area line tracks 2.5/2.5 mil and have 2.0mil space after compensation
0.5	4/4mil		Partial area line tracks 3/3 mil and have 2.5mil space remained after compenstaion
1	5/5mil		Partial area line tracks 4/4mil and have 3.5mil space remained after compensation.
2	7/7mil		6/6mil
3	9/9mil		8/8mil
4	11/11mil		10/10mil
5	13/13mil		11/11mil
6	15/15mil		13/13mil
Outer Layer Track Width and Space
Base copper (OZ)	Track width and space (before compensation), unit: mil
	Standard Process		Advanced Process
0.3	4/4		Local tracks 3/3 mil and have 2.5mil space remained after compensation
0.5	5/5		Partial area line tracks 3/3 mil and have 2.5mil space remained after compensation
1	6/6		Partial area line tracks 4/4mil and have 3.5mil space remained after compensation
2	7/7		6/6
3	9/9		8/8
4	11/11		10/10
5	13/13		11/11
6	15/15		13/13
Etching Width and Height
Base copper (OZ)	Silkscreen width before compensation (unit:mil)
	Silkscreen Width				Silkscreen Height
0.3	8				40
0.5	8				40
1	10				40
2	12				50
3	14				60
4	16				70
5	18				80
6	20				90
Space Between Pads and Copper in Outer and Inner layers
Base copper (OZ)	Space (mil)
	Standard Process				Advanced Process
0.3	3				2.4
0.5	3				2.4
1	5				4
2	8				6
3	10				8
4	12				10
5	14				12
6	16				14
Space Between Holes and Tracks in Inner Layer
Base copper (OZ)	Standard Process (mil)				Advanced Process (mil)
	4L	6L	8L	≥10L	4L	6L	8L	≥10L
0.5	5.5	6.5	7.5	8	5	6	6	6.5
1	5.5	6.5	7.5	8	5	6	6	6.5
2	5.5	6.5	7.5	8	5	6	6	6.5
3	5.5	6.5	7.5	8	5	6	6	6.5
4	5.5	6.5	7.5	8	5	6	6	6.5
5	5.5	6.5	7.5	8	5	6	6	6.5
6	5.5	6.5	7.5	8	5	6	6	6.5
Remarks: When it is less than 0.5mil of Advanced Process, the cost will be doubled.
Hole Copper Thickness
Base copper (OZ)	Hole copper thickness (mm)
	Standard Process			Advanced Process			Limit
0.33	≥18			≥25			≥35
0.5	≥18			≥25			≥35
1	≥18			≥25			≥35
2	≥18			≥25			≥35
3	≥18			≥25			≥35
4	≥18			≥25			≥35
Hole Size Tolerance
Types	Standard Process			Advanced Process			Remarks
Min hole size	Board thickness ≤2.0mm： Min hole size 0.20mm			Board thickness≤0.8mm： Min hole size 0.10mm			Special types needs to review

	Board thickness>2.0mm, Min hole size: aspect ratio≤10 (for drill bit)			Board thickness≤1.2mm： Min hole size: 0.15mm

Max hole size	6.0mm			>6.0mm			Use milling to enlarge holes
Max board thickness	1-2layers: 6.0mm			6.0mm			Pressed lamination by ourselves
	Multilayer: 6.0mm			6.0mm
Hole position tolerance
Types	Hole size tolerance (mm)
	0.00-0.31		0.31-0.8		0.81-1.6 0	1.61-2.49	2.5-6.0	>6.0
PTH Hole	+0.08/-0.02		±0.08		±0.08	±0.08	±0.08	±0.15
NPTH Hole	±0.05		±0.05		±0.05	±0.05	±0.05	±0.15
PTH Slot	Hole size<10mm: tolerance±0.13mm hole size≥10mm:tolerance±0.15mm
NPTH Slot	Hole size<10mm: tolerance±0.15mm hole size≥10mm:tolerance± 0.20mm
Pads size
Types	Standard Process		Advanced Process		Remarks
Annular ring of via holes	4mil		3.2mil		1.Compensation shall be made according to the base copper thickness. The copper thickness is increased by 1oz, the annular ring shall be increased by 1mil in compensation. 2.If BGA solder pads<8mil, the board’s base copper should be less than 1oz.
Annular ring of component hole	7mil		6mil
BGA solder pads	10mil		6-8mil
Mechanical processing (1)
Types	Standard Process			Advanced Process			Remarks
V-cut	V-cut line width: 0.3-0.6mm
	Angles: 20/30/45/60			Check with engineer for special angles			Need to buy V-cut knife for special angles
	Max size: 400
	Min size：50*80			Min size：50*80
	Registration tolerance: +/-0.2mm			Registration tolerance: +/-0.15mm
	1L min board thickness: 0.4mm			1L min board thickness: 0.4mm
	Max board thickness 1.60mm			Max board thickness 2.0mm
	Max size 380mm Min size 50mm			Max size 600mm Min size 40mm

	2L min board thickness 0.6mm			2L min board thickness 0.4mm
Board edge routed	Board thickness: 6.0mm
Tolerance	Max lengthwidth: 500600			Max lengthwidth：5001200 only for 1-2L
	L≤100mm：±0.13mm			L≤100mm：±0.10mm
	100mm＜L≤200mm：±0.2mm			100mm＜L≤200mm：±0.13mm
	200mm＜L≤300mm：±0.3mm			200mm＜L≤300mm：±0.2mm
	L>300mm:±0.4mm			L>300mm:±0.2mm
Space between tracks and board edge	Outline routed:0.20mm
	V-cut: 0.40mm
Countersunk hole	+/-0.3mm			+/-0.2mm			By hand
Half PTH holes	Min hole 0.40mm ,space 0.3mm			Min hole0.3mm,space 0.2mm			180±40°(Not apply for gold plating)
Routing stepped hole	Max hole size 13mm			Min hole size 0.8mm
Beveling	Gold finger chamfer angles and tolerance			20°、25°、30°、45° tolerance±5°
	Gold finger chamfer residual thickness tolerance			±5 mil
	Minimum Angle radius			0.4 mm
	Beveling height			35~600 mm
	Beveling length			30~360 mm
	Beveling depth tolerance			±0.25 mm
Slots	±0.15			±0.13m			Gold Finger,Board Edge
				±0.1(Optronics products)			Outsource
Routing inner slots	Tolerance ±0.2mm			Tolerance±0.15mm
Conical holes angles	Larger hole 82º、90º、120º			Diameter ≤6.5 mm(>6.5 mm need to review)
Stepped holes	PTH and NPTH, larger hole angle 130º			Diameter ≤10mm need to review
Back Drilling holes	Tolerance ±0.05mm
Mechanical processing (2)
Min values	Min slot width: CNC rout: 0.8mm CNC drill: 0.6 mm			CNC rout 0.5mm CNC drill 0.5mm			Need Purchase


Outline rout knife and positioning dowel	Knife diameter: 3.175/Φ0.8/Φ 1.0/Φ1.6/Φ2.0mm			Knife diameter: Φ0.5mm			Need Purchase

	Min positioning hole: Φ1.0mm
	Max positioning hole: Φ5.0mm
V-cut details(as below):　 35mm≤A≤400mm B≥80mm C≥5mm




Lamination
Types	Standard Process		Advanced Process		Remarks
Min board thickness	4L:0.4mm; 6L:0.6mm; 8L:1.0mm; 10L:1.2mm		4L:0.3mm; 6L:0.4mm; 8L:0.8mm; 10L:1.0mm		For Advanced Process ,only can do HOZ for inner layer.
Multilayer (4-12)	450x550mm		550x810mm		This is the max unit size.
Layers	3-20L		>20L
Lamination thickness tolerance	±8%		±5%
Inner layer copper thickness	0.5/1/2/3/4/5oz				4/5/6oz should be completed with self-pressing material or electroplate to strength the copper thickness.

Inner layer mixed copper thickness	18/35μm ,35/70μm
Base Material Types
Types	Standard Process			Advanced Process			Remarks
1-2L	Refer to Main Material List			0.06/0.10/0.2mm
Material Types	FR-4
	Halogen-free
	Rogers all series
	High TG and thick copper						TG170OC, 4OZ
	Samsung, TUC						1/2 layer
	BT material
	PTFE						All PTFE types
	ARLON
Special Requirements
Types	Standard Process			Advanced Process			Remarks
Blind and Buried Vias	Meet Standard Process requirement.			For asymmetrically buried and blind via boards, the bow and twist can’t be guaranteed within 1%.


Immersion Sn				Outsource
Immersion silver				Outsource
Board Edge Plated	Single side or double sides, if plated 4 edges, there must have joints.
ENIG+OSP	Peelable mask should be more than 2mm on LF HASL boards.And should be more than 1mm on ENIG or OSP boards.
Gold finger+OSP
ENIG+LF HASL
Special material and process	Coil boards			Must meet Standard Process requirements.
	Inner layer hollowed out
	Outer layer hollowed out
	Rogers series
	PTFE
	TP-2
	Free-issued materials
	Arlon series
	Via in pads
	Special shaped hole/slot			Countersunk hole,half hole,stepped hole,depth slot,board edge plated etc.
	Impedance boards			+/-10% (≤+/-5% need to review)
	FR4+microwave material+metal core			Need to review
	Partial thick gold			Local gold thickness: 40U"
	Partial mixed material laminating			FR4+Ceramic Filled Hydrocarbon
	Partial higher pads			Need to review
Surface finish
Surface Plating Thickness (U")	Leaded HASL
	Lead Free: ENIG, LF HASL, Immersion Sn, Immersion Silver, OSP
	Process	Surface	Min	Max	Advanced Process
	ENIG on whole panel	Ni	150	600	1200
		Au	1	3	Special requirement could reach 50um
	ENIG	Ni	80	150	Up to 400um without solder mask
		Au	1	5	Need to review for gold thickness 5-20U"
	Gold fingers	Ni	100	400
		Au	5	30	Up to 50um
	Immersion Sn	Sn	30	50
	Immersion silver	Ag	5	15
	LF HASL	Sn	50	400
Surface Plating Thickness (U")	HASL	Sn	50	400	Non RoHS product
	OSP	Oxidation film	0.2-0.5um
	Solder mask	Thickness	On tracks 10-20um		Can repeat print several times to increase the thickness
			On base material 20-400um		Will add as per copper thickness
	Silkscreen thickness(mm)		7-15um		This is for single legend thickness, could do repeat printing for large size legends.

	Peelable mask thickness(um)		500-1000um
Holes Covered by Peelable Mask	PTH hole ≤1.6mm		Please advice on spec. if it is out of the requirement.
HASL Boards	Board thickness ≤ 0.6mm,do not apply for HASL surface.
Selective Surface Finish	ENIG+OSP, ENIG+gold finger, Immersion silver+gold finger,Immersion TIN+gold finger, LF HASL+gold finger
Plating in Holes
Process	Types		Min thickness		Max thickness		Advanced Process
PTH	Plating thickness in holes		18-20um		25um		35-50um
Base Copper Thickness	Copper thickness of inner and outer layer		0.3/0.5		3		4-6
Finish Copper Thickness	Outer layer		1		4		5-8
	Inner layer		0.5		3		4-6
Insulation Thickness			0.08		N/A		0.06
Finish Board Thickness Tolerance
Finish Board Thickness	Standard Process			Advanced Process			Remarks
≦1.0mm	±0.10mm
1.0mm~1.6mm(included)	±0.14mm
1.6mm~2.0mm(included)	±0.18mm
2.0mm~2.4mm(included)	±0.22mm
2.4mm~3.0mm(included)	±0.25mm
>3.0	±10%
Solder Mask
Color	Green, matt green, blue, matt blue, black, matt black, yellow, red, and white etc.
Min solder mask bridge width	Green 4mil, other colours 4.8mil
Solder Mask Thickness	Standard 15-20um				Advanced: 35um
Solder Mask Filling Holes	0.1-0.5mm

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