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Home > products > HDI PCB Board >
High Precision HDI PCB Board with Misalignment Of Layers /- 0.06 4L Min. Bga Pitch 0.3mm

High Precision HDI PCB Board with Misalignment Of Layers /- 0.06 4L Min. Bga Pitch 0.3mm

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Product Details
Impedance Control:
+/-10%
Bga:
10MIL
Pth Wall:
25um
Blind Vias:
Yes
Aspect Ratio:
10:1
Process:
Immersion Gold/sliver
Testing:
100%E-Testing,X-RAY
Board Layer:
4L
Payment & Shipping Terms
Product Description

Product Description:

Are you searching for the perfect High Density Interconnect (HDI) PCB Board for your next project? Look no further than our cutting-edge HDI PCB Board, designed to meet the demands of high-speed and high-density model board applications.

Our HDI PCB Board goes through a meticulous manufacturing process, ensuring top-notch quality and performance. The board features immersion gold/silver process, guaranteeing reliable connectivity and signal transmission. With surface finishing options such as gold plating and HASL lead-free, our HDI PCB Board is built to withstand various environmental conditions while maintaining optimal functionality.

One of the key highlights of our HDI PCB Board is its exceptional aspect ratio of 10:1. This feature allows for intricate and compact designs, perfect for applications requiring a high density of components within a limited space. With a minimum BGA pitch of 0.3mm, our board is well-suited for projects that demand precise and efficient PCB layouts.

At our facility, quality is paramount. That's why we conduct a 100% electrical test on each HDI PCB Board prior to shipment. This rigorous testing process ensures that every board that leaves our manufacturing facility meets the highest standards of performance and reliability, giving you peace of mind for your projects.

Whether you are working on high-speed PCB designs, high-density model boards, or other advanced applications, our HDI PCB Board is the ideal choice to bring your concepts to life. Trust in our expertise and superior quality to take your projects to the next level.


Features:

  • Product Name: HDI PCB Board
  • Impedance Control: +/-10%
  • Key Words: High Density Interconnector
  • Spacing: P1.5
  • Test: 100% Electrical Test Prior Shipment
  • Testing: 100%E-Testing, X-RAY

Technical Parameters:

Key Words High Density Interconnector
Test 100% Electrical Test Prior Shipment
Aspect Ratio 10:1
Misalignment Of Layers +/- 0.06
Board Layer 4L
Pth Wall 25um
Min. Bga Pitch 0.3mm
Impedance Control +/-10%
Process Immersion Gold/silver
Blind Vias Yes

Applications:

High Density Model Board (HDI PCB) is a specialized type of printed circuit board known for its high-density interconnections and compact design. With advanced features such as Blind Vias, BGA of 10MIL, 100% E-Testing, X-RAY testing, ENIG finish, and 4 board layers, HDI PCBs are ideal for a wide range of applications across various industries.

One of the primary product application occasions for HDI PCB boards is in the field of consumer electronics. With the increasing demand for smaller and thinner electronic devices, such as smartphones, tablets, and wearables, HDI PCBs offer a compact solution with their high-density interconnections and reduced footprint. The Blind Vias technology enables the connection of multiple layers in a more efficient manner, making HDI PCBs perfect for miniaturized consumer electronics.

In the automotive industry, HDI PCB boards find significant use in advanced driver assistance systems (ADAS), infotainment systems, and electronic control units (ECUs). The high-density interconnections and BGA of 10MIL allow for the integration of complex circuitry within limited space, ensuring reliable performance in vehicles. Moreover, the ENIG finish provides excellent corrosion resistance, making HDI PCBs suitable for the demanding automotive environment.

For aerospace and defense applications, the reliability and performance of HDI PCBs are crucial. The 100% E-Testing and X-RAY testing capabilities ensure that each board meets stringent quality standards and is free from defects. With the ability to support complex multilayer designs, HDI PCBs are used in radar systems, communication equipment, and avionics, where space constraints and signal integrity are paramount.

In summary, the versatility and advanced features of HDI PCB boards make them indispensable in various industries requiring High Density Model Board solutions. Whether in consumer electronics, automotive systems, aerospace, or other high-tech applications, HDI PCB manufacturing plays a key role in enabling compact and reliable electronic devices.


Customization:

With our Product Customization Services for HDI Printed Circuit Boards (PCB), we offer the following attributes to meet your specific requirements:

  • Misalignment Of Layers: +/- 0.06
  • Impedance Control: +/-10%
  • Min. Bga Pitch: 0.3mm
  • Aspect Ratio: 10:1
  • Board Layer: 4L

Our customization services ensure that your HDI PCB Manufacturing needs, especially for DDR4 PCB, are met with precision and reliability.


Support and Services:

The HDI PCB Board product offers comprehensive Product Technical Support and Services to ensure optimal performance and customer satisfaction. Our dedicated technical support team is available to assist with any product-related inquiries, troubleshooting, and guidance on best practices.


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