Layers: 12 Layers
Material: Shengyi S1000 TG170
Layers: 14 Layers
Material: TG180 IT180
Pcb Name: 4L 1+N+1 HDI Boards
Key Words: High Density Interconnector
Raw Material: FR4 IT180
Layer Count: 4-20 Layers
Minimum Hole Size: 0.15mm
Raw Material: FR4 IT180
Impedance Control: Yes
Aspect Ratio: 10:1
Board Layer: 6-32L
Aspect Ratio: 10:1
Raw Material: FR4 IT180
Pcb Name: 4L 1+N+1 HDI Boards
Special Request: Half Hole, 0.25mm BGA
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Aspect Ratio: 10:1
Minimum Hole Size: 0.15mm
Layer Count: 4-20 Layers
Minimum Hole Size: 0.15mm
Key Words: High Density Interconnector
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Raw Material: FR4 IT180
Pcb Name: 4L 1+N+1 HDI Boards
Testing: 100%E-Testing,X-RAY
Pcb Name: 4L 1+N+1 HDI Boards
Key Words: High Density Interconnector
Layer Count: 4-20 Layers
Send your inquiry directly to us