Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Silkscreen: White, Black, Yellow, Etc.
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Finished Copper Thickness: 1oz
Silkscreen: White, Black, Yellow, Etc.
Mini Holes: 0.1mm
Min. Solder Mask Bridge: 0.075mm
Key Words: High Density Interconnector
Testing: 100%E-Testing,X-RAY
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Hole Size: 0.1mm Laser Drill
Thickness: 0.4-3.2mm
Special Requirements: Lamp Socket
Min Trace: 3/3Mil
Board Layer: 6-32L
Testing: 100%E-Testing,X-RAY
Thickness: 0.4-3.2mm
Layer Count: 4-20 Layers
Testing: 100%E-Testing,X-RAY
Minimum Hole Size: 0.15mm
Pcb Name: 4L 1+N+1 HDI Boards
Impedance Control: Yes
Testing: 100%E-Testing,X-RAY
Key Words: High Density Interconnector
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Aspect Ratio: 10:1
Raw Material: FR4 IT180
Board Layer: 6-32L
Hole Size: 0.1mm Laser Drill
Raw Material: FR4 IT180
Thickness: 0.4-3.2mm
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