Product Type: PCB Assembly
Bend Radius: 0.5-10mm
Pcb Layer: 1-28layers
No Of Layers: 4 Layer
Pcb Layer: 1-28layers
Product Type: PCB Assembly
Components: SMD, BGA, DIP, Etc.
Surface Finishing: HASL LF
Profiling Punching: Routing, V-CUT, Beveling
Material: FR4, Polyimide, PET
Max Layer: 52L
Material: FR4, Polyimide, PET
Minimum Trace/Space: 0.1mm
No Of Layers: 4 Layer
Sanforized: Local High Density, Back Drill
Profiling Punching: Routing, V-CUT, Beveling
Material: FR4, Polyimide, PET
Flexibility: 1-8 Times
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Material: FR4, Polyimide, PET
Pcb Layer: 1-28layers
Surface Finishing: HASL LF
Dimension: 41.55*131mm
Profiling Punching: Routing, V-CUT, Beveling
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Max Layer: 52L
No Of Layers: 4 Layer
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