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Foldable Rigid Flex Circuit Boards Assembly For Electronic Products

Foldable Rigid Flex Circuit Boards Assembly For Electronic Products

Foldable Rigid Flex Circuit Boards

Electronic Products Rigid Flex Circuit Boards

Foldable rigid and flexible pcb

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Product Details
Pcb Layer:
Product Type:
PCB Assembly
Profiling Punching:
Routing, V-CUT, Beveling
Bend Radius:
Surface Finishing:
Max Layer:
No Of Layers:
4 Layer
ENIG/OSP/Immersion Gold/Tin/Silver
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Product Description

Flexible Rigid Circuit Board Assembly 4 Layer Enig Surface Finish Pcb For Electronic Products

Product Description:

The Rigid Flex PCB, a pinnacle of modern engineering in the realm of electronics, seamlessly integrates the robustness of traditional rigid printed circuit boards with the versatility of flexible circuit technology. This hybrid solution is meticulously crafted to meet the demanding standards of high-precision applications, ensuring reliability and performance in a diverse range of products from sophisticated medical devices to rugged aerospace components and cutting-edge consumer electronics.

Our Rigid Flexible Printed Circuit Board boasts an impressive bend radius range of 0.5-10mm. This feature allows the PCB to be flexed or folded without compromising the integrity of the electrical connections, providing unparalleled flexibility in design and functionality. It also enables the board to fit into unconventional and compact spaces, expanding the possibilities for innovation in product design.

Constructed as a 4 Layer Rigid Flex PCB, our product provides ample space for complex circuits while maintaining a slim profile. Each layer is meticulously organized to optimize electrical performance and minimize cross-talk, ensuring that signals are transmitted with utmost clarity and efficiency. With four layers of high-quality material, designers have the freedom to create intricate circuit layouts essential for multifunctional and sophisticated electronic devices.

The local high-density sanforization process is a testament to our commitment to excellence. This specialized technique enhances the structural stability of the board, allowing it to withstand the mechanical stresses of folding and bending. The back drill technology employed further refines signal integrity by removing any residual stubs in the vias, which can cause unwanted reflections and loss of signal quality. Such attention to detail in the manufacturing process underscores our dedication to delivering a Rigid Flex PCB that is both durable and high-performing.

Precision is key in the creation of our Foldable Rigid Circuit Board, and this is reflected in the minimum trace/space specification of 0.1mm. Such fine line technology allows for more traces per unit area, contributing to the miniaturization of electronic devices without sacrificing functionality. As electronic components continue to shrink in size, our Flexible-Bendable PCB evolves in tandem, offering solutions that are both space-efficient and powerful.

To ensure the highest quality and longevity, our Rigid Flex PCB undergoes a range of surface treatment processes, including ENIG (Electroless Nickel Immersion Gold), OSP (Organic Solderability Preservatives), Immersion Gold, Immersion Tin, and Immersion Silver. Each treatment is carefully selected to enhance the solderability and protect the copper traces from oxidation. The ENIG process, in particular, provides a flat surface which is ideal for fine-pitch components, while OSP serves as a cost-effective option for those seeking a short-term finish. Immersion Gold offers excellent surface planarity, and Immersion Tin and Silver provide reliable alternatives with their own unique benefits.

Our Rigid Flex PCB is designed to meet the diverse needs of industries that demand high-performance and reliability. With its exceptional bend radius, meticulous layer construction, state-of-the-art sanforization and back drilling techniques, and a variety of surface treatments, this Flexible-Bendable PCB stands as a testament to technological progress. Whether for use in advanced communication devices, medical technology, or aerospace and automotive applications, our Foldable Rigid Circuit Board is the solution that engineers and designers have been searching for – a product that bridges the gap between the mechanical flexibility of flex circuits and the electrical capabilities of rigid boards.



  • Product Name: Rigid Flex PCB
  • Material: FR4, Polyimide, PET
  • Product Type: PCB Assembly
  • Components: SMD, BGA, DIP, Etc.
  • Pcb Layer: 1-28layers
  • Hole Position Deviation: ±0.05mm
  • Also known as: Bendable Rigid Printed Wiring Board
  • Also known as: Rigid Flexible Printed Circuit Board
  • Also known as: Foldable Rigid Circuit Board

Technical Parameters:

Technical Parameter Specification
Treatment ENIG/OSP/Immersion Gold/Tin/Silver
Surface Finishing HASL LF
Material FR4, Polyimide, PET
Bend Radius 0.5-10mm
Flexibility 1-8 Times
Product Type PCB Assembly
Dimension 41.55*131mm
Hole Position Deviation ±0.05mm
No Of Layers 4 Layer
Profiling Punching Routing, V-CUT, Beveling


The Rigid Flex PCB product, a remarkable innovation in the electronics industry, offers a unique combination of rigidity and flexibility that is essential in modern electronic applications. This Bendable Printed Circuit Board is designed to be flexed from 1 to 8 times, making it an ideal solution for a variety of applications where space is at a premium and complex geometries are required.

With surface treatments such as ENIG, OSP, Immersion Gold, Tin, and Silver, the Rigid Flex PCB ensures excellent surface planarity and reliable solderability, which is critical in achieving strong mechanical bonds and electrical connections. The Surface Finishing of HASL LF (Hot Air Solder Leveling Lead-Free) further enhances its environmental compliance and suitability for a multitude of industries, including medical, aerospace, and consumer electronics, where lead-free applications are mandatory.

The product type, being PCB Assembly, signifies that this Rigid Flex PCB is not merely a bare board but a complete assembly solution, integrating the rigid and flexible parts into a single, streamlined unit. This inherent design characteristic allows for a seamless transition between the rigid and flexible zones, making it an exceptional choice for dynamic applications that require both stability and adaptability.

One of the most significant technical attributes of this Rigid Flex Printed Wiring Board is its capability to have a Minimum Trace/Space of 0.1mm. This narrow trace and space allow for higher density circuits, which is a critical feature for sophisticated electronic devices that demand miniaturization without compromising performance.

Application occasions and scenarios for this Bendable Rigid Printed Wiring Board are vast. In wearable technology, the board's flexibility allows it to conform to ergonomic designs, comfortably integrating with the user's movements. In military and aerospace applications, the robustness and reliability of the rigid sections can withstand the demands of harsh environments, while the flexible sections can accommodate the need for dense component packaging and complex wiring that must fit into tight spaces.

Medical devices, particularly those that require mobility or are subject to frequent movement, benefit from the Rigid Flex PCB's ability to bend and flex without compromising the integrity of the electronic circuitry. Cameras, smartphones, and advanced sensors also utilize these boards for their ability to maintain high-speed signal integrity while being bent or folded within the constraints of sleek and compact designs.

In conclusion, the Rigid Flex PCB product is a versatile solution that caters to a multitude of scenarios where traditional rigid boards fall short. Its flexibility and durability, combined with advanced treatment options and the capability for fine trace spacing, make it an indispensable component in the ever-evolving landscape of electronic product design.



Our Rigid Flex PCB product offers extensive Product Customization Services to meet your precise design requirements. With a maximum layer count of 52L, our Flexible Stiff Circuit Board construction can accommodate complex designs and high-density applications. Precision is key in our manufacturing process, and we ensure a hole position deviation of only ±0.05mm, maintaining the integrity of your Flex-Rigid Printed Circuit Board connections.

Surface finishing is crucial for reliable soldering and long-lasting performance, which is why we offer HASL LF (Lead-Free Hot Air Solder Leveling) for our Flexible-Bendable PCBs. This environmentally-friendly option provides excellent surface planarity and is ideal for fine-pitch components.

To shape your PCB to exact specifications, our profiling punching options include Routing, V-CUT, and Beveling. These techniques ensure clean edges and precise dimensions for easy assembly and installation of your Flex-Rigid Printed Circuit Board.

For high-performance applications where space is at a premium, our Rigid Flex PCB can be customized with a minimum trace/space of 0.1mm, allowing for more circuits per unit area and supporting the trend of miniaturization in electronics.


Support and Services:

Rigid Flex PCB combines the best of both rigid boards and flexible circuits integrated together into one circuit. The product's technical support and services include assistance with design and layout, material selection, stack-up strategy, and manufacturing process optimization. Our team provides guidance on how to best utilize the Rigid Flex technology for your specific application, ensuring reliability, durability, and performance of the final product. We also offer troubleshooting support for any issues that may arise during the fabrication process or while in service, including electrical testing, structural analysis, and failure analysis if necessary. Our services aim to help you reduce time-to-market and improve the overall efficiency of your electronic assemblies.

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