hdi rigid flex pcb (34) Online Manufacturer
Components: SMD, BGA, DIP, Etc.
Surface Finishing: HASL LF
Hole Size: 0.1mm Laser Drill
Special Requirements: Lamp Socket
Layers: 12 Layers
Material: TACNIC TSM-DS3
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Profiling Punching: Routing, V-CUT, Beveling
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Material: FR4, Polyimide, PET
Flexibility: 1-8 Times
Flexibility: 1-8 Times
Surface Finishing: HASL LF
Pcb Layer: 1-28layers
No Of Layers: 4 Layer
Layers: 8 Layers
Material: Shengyi S1000
Layers: 7 Layers
Material: Shengyi S1000 TG170
Layers: 2
Material: TG170
Layers: 8 Layer
Material: ShengYi S1000
Layers: 1 Layer
Material: Aluminum 1W
Layers: 2 Layers
Material: AL2O3
Layers: 2 Layers
Material: FR4 KB6160
Layers: 7 Layers
Material: RO4350B+4450PP
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