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Customizable Glass Epoxy HDI PCB with 10 1 Aspect Ratio and OSP Surface Finish

Copper Thickness: 0.5oz-6oz

Key Words: High Density Interconnector

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SMT THT DIP Assembly Process HDI PCB Board with HASL Surface Finish and 0.5oz-6oz Copper Thickness

Thickness: 1.6mm, ±10%

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

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Surface Mount Technology Compatible HDI PCB Board with White Silkscreen and 1.6mm Thickness

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.

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1oz Finished Copper Thickness High Density Model Board with Immersion Silver Coated Surface Enhancement

Surface Mount Technology: Available

Thickness: 1.6mm, ±10%

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SMT THT DIP Assembly HDI PCB Board with Mini Holes 0.1mm and High Density Interconnector

Key Words: High Density Interconnector

Feature: Immersion Silver

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1.oz Final Foil External Double Layer PCB Board with 0.4mm Thickness and White Black Legend

Minimum Hole Diameter: 0.10 Mm

Pcba Standard: IPC-A-610E

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Final Foil External 1.oz Multilayer PCB with Immersion Gold for Reliability and Durability Designs

Packing: Vacuum Packing With Carton Box

Surface Treatment: Immersion Gold

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Final Foil External 1.oz Multilayer Printed Board 2-30 Layer Count for Products

Pcb: Single,double,multilayer Pcb,custom Pcb

Final Foil External: 1.oz

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2-30 Layer Count Multilayer PCB Board with 0.4mm Thinkness and HASL/OSP/ENIG Surface Finishing

Final Foil External: 1.oz

Surface Finishing: HASL/OSP/ENIG

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±10% Thickness White Silkscreen HDI PCB Board for Density Interconnect Applications

Mini Holes: 0.1mm

Min. Solder Mask Bridge: 0.075mm

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1.6mm Thickness HDI PCB Board with High Density Interconnector and 1oz Finished Copper Thickness

Finished Copper Thickness: 1oz

Silkscreen: White, Black, Yellow, Etc.

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16 1 Vias Aspect Ratio HD SDI Converter for High Definition Video Conversion in Broadcast Industry

Silkscreen: White, Black, Yellow, Etc.

Pcb Assembly Process: SMT THT DIP SMT PCB Assembly

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Advanced SMT THT DIP SMT PCB Assembly with HDI PCB Board and Min. Solder Mask Bridge 0.075mm

Copper Thickness: 0.5oz-6oz

Pcb Assembly Process: SMT THT DIP SMT PCB Assembly

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Enhance Your Circuit Design with FR-4 Ventec PCB and Impedance Control Technology

Base Material: Aluminum Base,CUSTOM

Material: FR-4

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