Impedance Control: Yes
Testing: 100%E-Testing,X-RAY
Key Words: High Density Interconnector
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Aspect Ratio: 10:1
Raw Material: FR4 IT180
Packing: Vacuum Packing With Carton Box
Surface Mount Technology: Yes
Surface Mount Technology: Yes
Number Of Layers: 4-32 Layers
Copper Thickness: 0.5oz-6oz
Max. Panel Size: 600mm*1200mm
Size: /
Special Requirements: Multiclass Impedance
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Thickness: 0.2mm-6.0mm
Board Layer: 6-32L
Hole Size: 0.1mm Laser Drill
Raw Material: FR4 IT180
Thickness: 0.4-3.2mm
Pcb Name: 4L 1+N+1 HDI Boards
Special Requirements: Lamp Socket
Special Request: Half Hole, 0.25mm BGA
Min Trace: 3/3Mil
Special Request: Half Hole, 0.25mm BGA
Aspect Ratio: 10:1
Min. Annular Ring: 3mil
Layer Count: Any Layer
Min. Annular Ring: 3mil
Solder Mask Color: Green, Red, Blue, Black, Yellow, White
Layer Count: Any Layer
Testing: Flying Probe Test, E-test
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