Impedance Control: +/-10%
Misalignment Of Layers: +/- 0.06
Impedance Control: +/-10%
Bga: 10MIL
Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Blind Vias: Yes
Key Words: High Density Interconnector
Min. Bga Pitch: 0.3mm
Impedance Control: +/-10%
Minimum Hole Diameter: 0.10 Mm
Min. Panel Size: 50mm X 50mm
Number Of Layers: 12-Layer
Silkscreen Color: White, Black, Yellow
Copper Weight: 0.25OZ~12OZ
Minimum Hole Diameter: 0.10 Mm
Surface Finishing: Plated Ni/Au
Min. Silkscreen Bridge: 0.1mm
Product: Print Circuit Board
Minimum Hole Diameter: 0.10 Mm
Surface Finishing: Plated Ni/Au
Silkscreen: White, Black, Yellow
Samples: Available
Surface: Immersion Gold
Board Thickness: 0.2-6.0mm
Min. Hole Size: 0.2mm
Materials: Ventec, Polytronics, Begquist
Board Thickness: 0.2-6.0mm
Min Line Space: 8mil
Processing: Assembly
Features: Gerber/PCB File Needed
Layer Count: 16 Layers
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