Max Layer: 52L
No Of Layers: 4 Layer
Bend Radius: 0.5-10mm
Product Type: PCB Assembly
No Of Layers: 4 Layer
Max Layer: 52L
Surface Finishing: HASL LF
No Of Layers: 4 Layer
Hole Position Deviation: ±0.05mm
Sanforized: Local High Density, Back Drill
Max Layer: 52L
Hole Position Deviation: ±0.05mm
Pcb Layer: 1-28layers
Product Type: PCB Assembly
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Dimension: 41.55*131mm
Max Layer: 32L
Minimum Trace/Space: 0.05mm
Layers: 12 Layers
Material: TACNIC TSM-DS3
Layers: 8 Layer
Material: ShengYi S1000
Min. Hole Size: 0.2mm
Thickness: 0.2mm-6.0mm
Number Of Layers: 4-22 Layers
Copper Weight: 12OZ
Copper Thickness: 0.5oz-6oz
Number Of Layers: 4-22 Layers
Packing: Vacuum Packing With Carton Box
Copper Weight: 12OZ
Service: One-stop Service OEM
Copper Thickness: 0.5oz-6oz
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