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Green Solder Mask Rigid Flex PCB with FR4 Stiffener and 0.6mm Thickness Advanced Technology

Features: Gerber/PCB File Needed

Finished Copper: 1OZ

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SMT THT DIP Assembly HDI PCB Board with Mini Holes 0.1mm and High Density Interconnector

Key Words: High Density Interconnector

Feature: Immersion Silver

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1oz Finished Copper Thickness High Density Model Board with Immersion Silver Coated Surface Enhancement

Surface Mount Technology: Available

Thickness: 1.6mm, ±10%

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Impedance Control Test Multilayer Circuit Board with 0.4mm Board Thickness

Thickness Of Copper: 0.5-14oz (18-490um)

Pcb: Single,double,multilayer Pcb,custom Pcb

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Surface Mount Technology Compatible HDI PCB Board with White Silkscreen and 1.6mm Thickness

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.

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1.oz Final Foil External Custom Pcb Multilayer PCB Board for Special Requirement Impedance Control Test

Thickness Of Copper: 0.5-14oz (18-490um)

Surface Finishing: HASL/OSP/ENIG

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SMT THT DIP Assembly Process HDI PCB Board with HASL Surface Finish and 0.5oz-6oz Copper Thickness

Thickness: 1.6mm, ±10%

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

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IPC-A-610E Standard HASL/OSP/ENIG PCB Board with Immersion Gold and 0.5-14oz 18-490um Copper Thickness

Minimum Hole Diameter: 0.10 Mm

Final Foil External: 1.oz

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Customizable Glass Epoxy HDI PCB with 10 1 Aspect Ratio and OSP Surface Finish

Copper Thickness: 0.5oz-6oz

Key Words: High Density Interconnector

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Custom PCB Multilayer PCB Board with 0.4mm Thickness and 4L-28L Layers Performance

Packing: Vacuum Packing With Carton Box

Size: As Per Gerber

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100%E-Testing Glass Epoxy PCB Board with Blind And Buried Vias and Immersion Surface

Blind And Buried Vias: Available

Thickness: 0.4-3.2mm

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