Profiling Punching: Routing, V-CUT, Beveling
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Material: FR4, Polyimide, PET
Flexibility: 1-8 Times
Sanforized: Local High Density, Back Drill
Profiling Punching: Routing, V-CUT, Beveling
Minimum Trace/Space: 0.1mm
No Of Layers: 4 Layer
Max Layer: 52L
Material: FR4, Polyimide, PET
Profiling Punching: Routing, V-CUT, Beveling
Material: FR4, Polyimide, PET
Hole Position Deviation: ±0.05mm
Bend Radius: 0.5-10mm
Product Type: PCB Assembly
Bend Radius: 0.5-10mm
Pcb Layer: 1-28layers
No Of Layers: 4 Layer
Pcb Layer: 1-28layers
Product Type: PCB Assembly
Components: SMD, BGA, DIP, Etc.
Surface Finishing: HASL LF
Material: FR4, Polyimide, PET
Sanforized: Local High Density, Back Drill
Flexibility: 1-8 Times
Surface Finishing: HASL LF
Material: FR4, Polyimide, PET
Sanforized: Local High Density, Back Drill
Components: SMD, BGA, DIP, Etc.
Hole Position Deviation: ±0.05mm
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Surface Finishing: HASL LF
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