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Density Wiring Board Impedance Control and 3mil Min. Annular Ring for Optimal Signal Integrity,Panasonic M7,M8,HDI portotype PCB

Density Wiring Board Impedance Control and 3mil Min. Annular Ring for Optimal Signal Integrity,Panasonic M7,M8,HDI portotype PCB

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Product Details
Min. Annular Ring:
3mil
Solder Mask Color:
Green, Red, Blue, Black, Yellow, White
Surface Finish:
HASL, ENIG, Immersion Silver, OSP
Testing:
Flying Probe Test, E-test
Minimum Hole Size:
0.1mm
Layer Count:
Any Layer
Min. Finished Hole Size:
0.1mm
Impedance Control:
Yes
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Product Description

Product Description:

Our HDI Any Layer PCBs have a minimum annular ring of 3mil, making it a perfect choice for high-density applications. Additionally, with a layer count of any layer, these PCBs are designed to provide maximum flexibility and functionality.

Our HDI Any Layer PCBs come with a lead time of 2-5 days, allowing us to deliver products within a short period. This makes it ideal for industries where quick turnaround times are critical.

At our facility, we ensure that our HDI Any Layer PCBs undergo rigorous testing, including Flying Probe Test and E-test, to guarantee quality and reliability. This testing process ensures that our PCBs meet the industry's highest standards, making them suitable for use in critical applications.

Our HDI Any Layer PCBs have a minimum hole size of 0.1mm, making them ideal for high-density applications where space is limited. These PCBs are designed to handle complex designs with ease, making them ideal for use in applications where high-density assembly systems are required.

In conclusion, our HDI Any Layer PCBs are designed to meet the demands of high-density assembly systems and miniature interconnect systems. With a minimum annular ring of 3mil, a lead time of 2-5 days, any layer count, rigorous testing, and a minimum hole size of 0.1mm, these PCBs offer exceptional performance and reliability, making them ideal for use in critical applications.

 

Features:

  • Product Name: HDI Any Layer PCBs
  • High Density Interconnect Any Layer, High-Density Interconnect, Any-Layer Interconnect Board
  • Min. Annular Ring: 3mil
  • Silkscreen Color: White, Black, Yellow
  • Lead Time: 2-5 Days
  • Surface Finish: HASL, ENIG, Immersion Silver, OSP
  • Min. Finished Hole Size: 0.1mm
 

Technical Parameters:

Product Attribute Value
Product Name High-Density Interconnect (HDI) Any Layer PCBs
Min. Finished Hole Size 0.1mm
Solder Mask Color Green, Red, Blue, Black, Yellow, White
Layer Count Any Layer
Minimum Hole Size 0.1mm
Material FR-4
Copper Weight 0.5oz-6oz
Surface Finish HASL, ENIG, Immersion Silver, OSP
Impedance Control Yes
Silkscreen Color White, Black, Yellow
Thickness 0.2mm-6.0mm
 

Applications:

 

Customization:

Our High-Density Integrated Circuit Interconnection Board, also known as HDI Any Layer PCBs, can be customized to meet your specific needs. With material made of FR-4 and any layer count, our HDI boards are perfect for your High-Density Interconnect and High-Density Assembly System requirements.

Our product customization services include:

  • Min. Annular Ring: 3mil
  • Surface Finish: HASL, ENIG, Immersion Silver, OSP
  • Impedance Control: Yes
 

Support and Services:

The HDI Any Layer PCBs product offers a range of technical support and services to ensure optimal performance and customer satisfaction. Our team of experts is available to assist with any questions or concerns regarding product specifications, design guidelines, and troubleshooting. We also offer design review and optimization services to ensure the highest quality and efficiency in your PCB production. Additionally, we provide testing and validation services to ensure that our products meet all industry standards and regulations. Overall, our goal is to provide comprehensive support and services to our customers so that they can achieve the best results possible with our HDI Any Layer PCBs.

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