Packing: Vacuum Packing With Carton Box
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Impedance Control: Yes
Hole Size: 0.1mm Laser Drill
Layer Count: 4-20 Layers
Hole Size: 0.1mm Laser Drill
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Aspect Ratio: 10:1
Raw Material: FR4 IT180
Pcb Name: 4L 1+N+1 HDI Boards
Key Words: High Density Interconnector
Special Requirements: Lamp Socket
Pcb Name: 4L 1+N+1 HDI Boards
Thickness: 0.4-3.2mm
Impedance Control: Yes
Hole Size: 0.1mm Laser Drill
Pcb Name: 4L 1+N+1 HDI Boards
Layer Count: 4-20 Layers
Surface Finishing: CUSTOM
Materials: Ventec, Polytronics, Begquist
PCB Thickness: 0.6-6.0MM
Type: Insulation Sheet,PCB Base Board
Max Layer: 52L
No Of Layers: 4 Layer
ISO Certification: ISO 9001:2015, ISO 14001:2015, ISO 13485:2016
PCB Thickness: 0.6-6.0MM
Number Of Layers: 1 Layer Printed Circuit Board
Surface Finish: HASL, ENIG, OSP, Immersion Silver
ISO Certification: ISO 9001:2015, ISO 14001:2015, ISO 13485:2016
Min. Line Width/Spacing: 0.075/0.075mm
Sample: Avaliable
Materials: Ventec, Polytronics, Begquist
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