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1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board

1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board

Rohs Package Substrate PCB

Rohs IC PCB Board

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Product Details
Substrate Type:
Minimum Hole Size:
Lead Time:
2 Weeks
Rohs Compliant:
10mm X 10mm
Copper Weight:
Minimum Trace Spacing:
Payment & Shipping Terms
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Product Description

Ceramic IC Substrate PCBs ROHS Compliant 1oz Copper Weight 2 Weeks Lead Time

Product Description:

The world of electronics is ever-evolving, with advancements in technology requiring components that are not only reliable but also capable of meeting the increasing demands for speed, efficiency, and miniaturization. Among the essential components in this technological evolution are the Integrated Circuit (IC) Substrate Printed Circuit Boards (PCBs), which serve as the backbone for electronic circuit interconnects. Our IC Substrate PCBs are specifically designed to cater to the needs of modern electronics, ensuring that your devices are equipped with the best possible foundation for performance and durability.

Our IC Substrate PCBs are crafted from high-quality ceramic materials, renowned for their excellent electrical insulation and thermal conductivity. Ceramic substrates are the material of choice for high-performance and high-reliability electronic circuit interconnects, as they provide a stable and robust platform for the components that drive today's electronic devices. The use of ceramic ensures that our PCBs can withstand the thermal stresses and the high-power densities that are often encountered in sophisticated electronic applications.

When it comes to the configuration of Printed Circuit Boards for ICs, the number of layers is a pivotal aspect. Our IC Substrate PCBs are designed with two layers, which allows for a compact size while still offering ample space for the necessary electronic components. This dual-layer structure is optimized for applications where space is at a premium, yet functionality cannot be compromised. It offers an efficient use of space, enabling the creation of more complex electronic devices without the need for a larger footprint.

In the realm of electronic circuit design, the spacing between traces is a critical parameter that can greatly influence the performance of the device. Our IC Substrate PCBs boast a minimum trace spacing of 0.1mm, which is indicative of our commitment to high precision and fine-line technology. This tight trace spacing enables the creation of high-density interconnects, allowing for more complex circuits in a smaller area. This is particularly important for the miniaturization of electronic devices, where every millimeter counts.

The substrate type plays a vital role in determining the application and performance of a PCB. Our substrates are of the rigid type, providing a solid and sturdy platform for electronic components. Rigid substrates are preferred in many applications due to their resilience and longevity. They maintain their form under stress and are less susceptible to damage during handling, assembly, and operation. This makes our IC Substrate PCBs an ideal choice for electronic devices that require a dependable and lasting interconnect solution.

Furthermore, our IC Substrate PCBs come with a standard copper weight of 1oz. Copper is an integral part of PCBs as it conducts electricity and transfers heat away from the components, thus playing a key role in the functionality and longevity of the device. The 1oz copper weight strikes an excellent balance between conductivity, thermal management, and structural integrity. It provides sufficient current carrying capacity for most IC applications, while also helping to dissipate heat effectively, ensuring that your devices operate within safe temperature limits.

In conclusion, our IC Substrate PCBs are a perfect synergy of material excellence, precise engineering, and thoughtful design. They cater to the demanding requirements of modern electronic circuit interconnects, providing a reliable and high-performance solution for a multitude of applications. Whether you are in the business of creating consumer electronics, medical devices, aerospace components, or any other sophisticated electronic systems, our Printed Circuit Boards for ICs are poised to deliver the quality and performance you need to stay ahead in the competitive electronics landscape.



  • Product Name: IC Substrate PCBs
  • Thickness: 0.2mm
  • Minimum Trace Spacing: 0.1mm
  • Rohs Compliant: Yes
  • Copper Weight: 1oz
  • Lead Time: 2 Weeks
  • Microelectronics Circuit Layers: Precision engineered for high-density microelectronics
  • Electronic Circuit Interconnects: Optimized for reliable electrical connections
  • Microchip Substrate Boards: Designed to support advanced microchip technologies

Technical Parameters:

Parameter Specification
Minimum Hole Size 0.2mm
Material Ceramic
Solder Mask Color Green
Copper Weight 1oz
Thickness 0.2mm
Maximum Operating Temperature 150°C
Minimum Trace Spacing 0.1mm
Surface Finish ENIG
Layers 2
Lead Time 2 Weeks


The IC Substrate PCB is a sophisticated platform designed for Semiconductor Packaging Boards, providing essential support and interconnection for microelectronic circuits. These substrates serve as the backbone for a variety of electronic circuit interconnects, ensuring reliable performance in diverse applications. With a lead time of just 2 weeks, these substrates can quickly become an integral part of your project, accommodating tight schedules without compromising on quality.

Manufactured using a rigid substrate type, these PCBs offer a sturdy base for the attachment of semiconductor chips and components. The rigidity of the substrate is crucial in applications where the integrity of the microelectronics circuit layers must be maintained under mechanical stress or vibration. This makes the IC Substrate PCBs ideal for use in high-reliability environments such as aerospace, automotive, and industrial control systems.

The IC Substrate PCBs are RoHS compliant, meaning they are manufactured without the use of restricted hazardous substances. This compliance is essential for electronic products that are sold in markets with strict environmental regulations, such as the European Union. Being RoHS compliant also reflects a commitment to environmental responsibility and the health and safety of both consumers and electronics industry workers.

These PCBs are engineered to withstand maximum operating temperatures of up to 150°C, ensuring that they can operate effectively in high-temperature environments. This feature is particularly important for power electronics, automotive under-hood applications, and industrial equipment where thermal management is a critical concern. The ability to withstand high temperatures expands the range of applications where these substrates can be employed, providing designers with a versatile solution for thermal challenges.

The surface finish of these IC Substrate PCBs is ENIG (Electroless Nickel Immersion Gold), which provides excellent surface planarity and a robust interface for soldering components. This finish also offers a high level of corrosion resistance, ensuring a long-lasting and reliable interconnection for electronic circuits. The ENIG finish is particularly beneficial in the semiconductor industry where long-term reliability of electronic circuit interconnects is paramount.

In summary, the IC Substrate PCBs are an ideal choice for a wide range of applications where robustness, reliability, and compliance with environmental standards are required. Whether used in consumer electronics, automotive systems, or industrial equipment, these substrates provide the necessary foundation for cutting-edge semiconductor packaging boards and electronic circuit interconnects.



Our IC Substrate PCBs offer a range of product customization services to meet the demanding requirements of Processor Platform PCBs, Microelectronics Circuit Layers, and Chip Board Assemblies. With a thickness of just 0.2mm, our high-precision IC Substrate PCBs are manufactured using durable Ceramic materials, ensuring longevity and reliability in high-temperature environments up to 150°C. Our advanced production capabilities allow for Minimum Trace Spacing of 0.1mm, enabling complex circuit configurations and high-density interconnections. Moreover, we cater to intricate design specifications with a Minimum Hole Size of 0.2mm, supporting sophisticated microelectronic components. Choose our IC Substrate PCBs for your customized needs in processor and chip board technologies.


Support and Services:

Our Product Technical Support and Services for IC Substrate PCBs are dedicated to providing comprehensive assistance to ensure your products operate at their peak performance. Our team of experienced technicians and engineers is available to offer expert advice, troubleshooting tips, and solutions to any technical challenges you may encounter with our IC Substrate PCBs. We provide an array of services including design consultation, performance optimization, and failure analysis to enhance the reliability and functionality of your applications. Our support extends to helping you understand the complex technical specifications and features of our products, ensuring that you can leverage the full potential of the IC Substrate PCBs in your projects. Please note that for any specific inquiries or issues, you should refer to the official contact channels provided with your product documentation or on our official website.

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