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High Performance IC Substrate PCB Matte black Solder Mask Electronics Components

High Performance IC Substrate PCB Matte black Solder Mask Electronics Components

High Performance IC Substrate PCB

IC Substrate PCB Electronics Components

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Product Details
Solder Mask Color:
Green
Minimum Trace Width:
0.1mm
Maximum Operating Temperature:
150°C
Substrate Type:
Rigid
Surface Finish:
ENIG
Copper Weight:
1oz
Minimum Hole Size:
0.2mm
Rohs Compliant:
Yes
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Product Description

Temperature Rigid IC Substrate PCBs 1oz Green Solder Mask 0.1mm Trace

Product Description:

The IC Substrate PCBs serve as a pivotal component in the realm of sophisticated electronics, providing a robust foundation for processor platforms and computer chip assemblies. These Integrated Circuit Substrate PCBs are specifically engineered to meet the stringent requirements of high-performance electronic devices, ensuring that they deliver the reliability and efficiency needed for today's advanced computing tasks.

Constructed from high-quality ceramic materials, these IC Substrate PCBs offer outstanding thermal stability and electrical insulation. Ceramic, known for its excellent high-frequency performance and low dielectric losses, makes these PCBs ideally suited for processor platform PCBs that demand high-speed signal transmission. The use of ceramic also contributes to the durability and longevity of the computer chip substrate panels, making them a preferred choice for applications that require superior mechanical strength and resistance to thermal shock.

One of the most critical features of these Integrated Circuit Substrate PCBs is their minimum trace spacing of 0.1mm. This fine trace spacing enables the creation of more intricate circuit designs, allowing for a greater number of connections within a compact area. The increased circuit density is essential for modern processor platform PCBs, which must accommodate a large number of transistors and other electronic components to deliver the processing power expected in current and future computing applications.

With a thickness of just 0.2mm, these IC Substrate PCBs are remarkably thin, which is an important attribute for modern electronics that require slim profiles without compromising performance. The slimness of these computer chip substrate panels contributes to the miniaturization of electronic devices, providing manufacturers with the ability to produce sleek, lightweight products that still pack a powerful punch.

Designed with a two-layer construction, these PCBs offer a balanced approach to complexity and cost-efficiency. While maintaining a simple layer structure, these layers are adept at supporting the functionality required by sophisticated integrated circuits. The two-layer design is also conducive to improved heat dissipation, which is critical for maintaining the performance and stability of the processor platforms.

In a fast-paced industry where time-to-market can be a critical factor, the lead time for the production of these IC Substrate PCBs is set at an efficient 2 weeks. This rapid turnaround ensures that clients can progress from design to deployment swiftly, keeping pace with the demands of the competitive electronics market. The commitment to a short lead time does not come at the expense of quality, as each PCB is meticulously crafted to meet the highest standards of precision and performance.

In conclusion, these IC Substrate PCBs are at the forefront of electronic component design, offering a combination of high-grade material, fine trace spacing, ultra-thin profile, and efficient layering to address the needs of advanced processor platforms and computer chip technologies. Whether for use in consumer electronics, industrial applications, or cutting-edge computing hardware, these Integrated Circuit Substrate PCBs stand as a testament to the evolution of electronic design, enabling devices to become more powerful, more compact, and more reliable than ever before.

 

Features:

  • Product Name: IC Substrate PCBs
  • Surface Finish: ENIG (Electroless Nickel Immersion Gold)
  • Minimum Hole Size: 0.2mm
  • Rohs Compliant: Yes
  • Minimum Trace Spacing: 0.1mm
  • Thickness: 0.2mm
  • Embedded System Circuit Boards
  • Integrated Circuit Substrate PCBs
  • Semiconductor Packaging Boards
 

Technical Parameters:

Technical Parameter Specification
Maximum Operating Temperature 150°C
Solder Mask Color Green
Layers 2
Lead Time 2 Weeks
Substrate Type Rigid
Size 10mm X 10mm
Material Ceramic
Surface Finish ENIG
Minimum Trace Spacing 0.1mm
Rohs Compliant Yes
 

Applications:

IC Substrate PCBs, known in the industry as microchip substrate boards, are a critical component in the fabrication of modern electronics. These boards are designed to support and connect integrated circuits (ICs) or computer chips. They are an essential part of a vast array of electronic devices, providing a stable and reliable platform for delicate chip components. The product application occasions and scenarios for these IC Substrate PCBs are diverse, ranging from consumer electronics to advanced computing systems.

In the realm of consumer electronics, IC Substrate PCBs, or computer chip substrate panels, are deployed extensively. They are hidden within the sleek designs of smartphones, tablets, and laptops. With a minimum trace width of 0.1mm, these PCBs are capable of meeting the high-density requirements needed for compact and multifunctional devices. The fine trace width allows for a greater number of connections in a smaller area, facilitating the miniaturization of electronic components.

The 1oz copper weight specification of these IC Substrate PCBs provides a balance between thickness and thermal conductivity, ensuring that the PCB can handle the electrical current requirements of the device while also dissipating heat effectively. The green solder mask color not only offers a recognizable and standardized look but also provides a protective layer to the copper circuits, guarding against oxidation and short circuits.

Professional and industrial computing systems also rely on the robustness of these microchip substrate boards. High-performance servers, data centers, and networking equipment require PCBs that are both reliable and compliant with strict industry standards. Being RoHS compliant, these IC Substrate PCBs meet the necessary environmental regulations, ensuring that no hazardous substances are used in their manufacture, which is increasingly important for companies focusing on sustainability.

In medical and aerospace industries, where precision and reliability are paramount, the quality of IC Substrate PCBs plays a crucial role. Devices such as pacemakers, diagnostic imaging equipment, flight control systems, and satellite communications all benefit from the precise manufacturing of these PCBs. With a lead time of only 2 weeks, manufacturers can quickly obtain the necessary IC Substrate PCBs to keep production schedules on track and maintain a competitive edge in the market.

In summary, IC Substrate PCBs are indispensable in today’s electronics landscape. Their applications span across various fields, including but not limited to consumer electronics, computing infrastructure, medical devices, and aerospace technology. The product’s attributes, such as minimum trace width, copper weight, solder mask color, RoHS compliance, and efficient lead time, make it an ideal choice for manufacturers looking for high-quality computer chip substrate panels for their next-generation electronic innovations.

 

Customization:

Our IC Substrate PCBs offer state-of-the-art customization services to meet the demands of advanced chip board assemblies. With precision engineering, we can accommodate a minimum hole size of 0.2mm, ensuring that even the most intricate microchip substrate boards are catered for. Our lead time is efficient, with a turnaround of just 2 weeks from order to dispatch.

Quality is paramount in the production of our microchip substrate boards, which is why we offer a surface finish of ENIG (Electroless Nickel Immersion Gold), providing both the reliability and the performance needed for your high-end applications. Our IC Substrate PCBs are available in a thickness of 0.2mm, suitable for a variety of chip board assemblies.

To further support the complexity of modern electronics, we offer a minimum trace spacing of 0.1mm, allowing for high-density interconnects and superior electrical performance in all of our microchip substrate boards. Customize your IC Substrate PCBs with us and experience the pinnacle of precision and quality.

 

Support and Services:

Our IC Substrate PCBs are designed to provide a high level of performance and reliability. To ensure that you can make the most of these products, we offer a comprehensive range of technical support and services tailored to meet your needs. Our technical support includes detailed product documentation, an extensive FAQ section, and troubleshooting guides that cover common issues and their resolutions. Additionally, we provide access to our team of experienced engineers who can assist with design considerations, product integration, and performance optimization.

We are committed to providing ongoing services throughout the lifecycle of your IC Substrate PCBs. This includes offering updates on the latest advancements in technology and how they can be applied to enhance your products. Our services also encompass product training sessions to ensure that your team is equipped with the knowledge to utilize the IC Substrate PCBs effectively. Furthermore, we provide diagnostic services to help identify and resolve any potential issues swiftly, minimizing downtime and maintaining the continuity of your operations.

Please note that our technical support and services are available during our standard business hours. For complex issues or in-depth technical assistance, we recommend reaching out to schedule a dedicated support session with one of our specialists. We are dedicated to ensuring your success with our IC Substrate PCBs and are here to help you every step of the way.

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