Profiling Punching: Routing, V-CUT, Beveling
Bend Radius: 0.5-10mm
Key Words: High Density Interconnector
Testing: 100%E-Testing,X-RAY
Testing: 100%E-Testing,X-RAY
Thickness: 0.4-3.2mm
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Hole Size: 0.1mm Laser Drill
Thickness: 0.4-3.2mm
Special Requirements: Lamp Socket
Min Trace: 3/3Mil
Board Layer: 6-32L
Min. Hole Size: 0.2mm
Copper Thickness: 0.5oz-6oz
Number Of Layers: 1 Layer Printed Circuit Board
Min. Line Width/Spacing: 0.075/0.075mm
Copper Thickness: 0.5-6.0oz
Type: Insulation Sheet,PCB Base Board
Surface Mount Technology: Yes
Packing: Vacuum Packing With Carton Box
Size: /
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Number Of Layers: 4-32 Layers
Copper Weight: 12OZ
Surface Finishing: CUSTOM
Sample: Avaliable
Silkscreen: White, Black, Yellow
Surface Finish: HASL, ENIG, OSP, Immersion Silver
Packing: Vacuum Packing With Carton Box
Min. Hole Size: 0.2mm
Min. Line Width/Spacing: 0.075/0.075mm
PCB Thickness: 0.6-6.0MM
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