Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Min Trace: 3/3Mil
Pcb Thickness: 1.6mm
Blind And Buried Vias: Available
Thickness: 0.4-3.2mm
Thickness: 0.4-3.2mm
Blind And Buried Vias: Available
Inner Layer Spacing: 0.15mm
Thickness: 0.4-3.2mm
Smallest Hole Size: 0.1mm
Min Via: 0.1mm
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Key Words: High Density Interconnector
Feature: Immersion Silver
Surface Treatment: Immersion Gold
Minimum Hole Diameter: 0.10 Mm
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Min. Panel Size: 50mm X 50mm
Surface: Immersion Gold
Silkscreen: White, Black, Yellow, Etc.
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Base Material: Aluminum Base,CUSTOM
Withstand Voltage: >3KV
Withstand Voltage: >3KV
Base Material: Aluminum Base,CUSTOM
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