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Customizable Glass Epoxy HDI PCB with 10 1 Aspect Ratio and OSP Surface Finish

Copper Thickness: 0.5oz-6oz

Key Words: High Density Interconnector

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100%E-Testing Glass Epoxy PCB Board with Blind And Buried Vias and Immersion Surface

Blind And Buried Vias: Available

Thickness: 0.4-3.2mm

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1oz Finished Copper Thickness High Density Model Board with Immersion Silver Coated Surface Enhancement

Surface Mount Technology: Available

Thickness: 1.6mm, ±10%

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SMT THT DIP Assembly HDI PCB Board with Mini Holes 0.1mm and High Density Interconnector

Key Words: High Density Interconnector

Feature: Immersion Silver

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IPC-A-610E Standard HASL/OSP/ENIG PCB Board with Immersion Gold and 0.5-14oz 18-490um Copper Thickness

Minimum Hole Diameter: 0.10 Mm

Final Foil External: 1.oz

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Custom PCB Multilayer PCB Board with 0.4mm Thickness and 4L-28L Layers Performance

Packing: Vacuum Packing With Carton Box

Size: As Per Gerber

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Immersion Gold Surface and 1oz Copper Multilayer Circuit Board for Special Requirements

Min. Panel Size: 50mm X 50mm

Surface: Immersion Gold

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16 1 Vias Aspect Ratio HD SDI Converter for High Definition Video Conversion in Broadcast Industry

Silkscreen: White, Black, Yellow, Etc.

Pcb Assembly Process: SMT THT DIP SMT PCB Assembly

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Advanced SMT THT DIP SMT PCB Assembly with HDI PCB Board and Min. Solder Mask Bridge 0.075mm

Copper Thickness: 0.5oz-6oz

Pcb Assembly Process: SMT THT DIP SMT PCB Assembly

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Yellow Silkscreen FR-4 IMS PCB 2-16 Layers for Optimal Performance

Base Material: Aluminum Base,CUSTOM

Withstand Voltage: >3KV

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