Surface Finishing: Plated Ni/Au
Silkscreen: White, Black, Yellow
Materials: Ventec, Polytronics, Begquist
Board Thickness: 0.2-6.0mm
Min Line Space: 8mil
Processing: Assembly
Surface Mount Technology: Available
Vip Process: Yes
Thickness Of Copper: 0.5-14oz (18-490um)
Surface Finishing: HASL/OSP/ENIG
Key Words: High Density Interconnector
Feature: Immersion Silver
Surface Treatment: Immersion Gold
Minimum Hole Diameter: 0.10 Mm
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Min. Panel Size: 50mm X 50mm
Surface: Immersion Gold
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Minimum Hole Diameter: 0.10 Mm
Final Foil External: 1.oz
Thickness Of Copper: 0.5-14oz (18-490um)
Pcb: Single,double,multilayer Pcb,custom Pcb
Min Trace: 3/3Mil
Pcb Thickness: 1.6mm
Blind And Buried Vias: Available
Thickness: 0.4-3.2mm
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