Number Of Layers: 4-32 Layers
Thickness: 0.2mm-6.0mm
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Special Requirements: Multiclass Impedance
Thickness: 0.2mm-6.0mm
Number Of Layers: 4-32 Layers
Thickness: 0.2mm-6.0mm
Layers: 4-22 Layer
Key Words: High Density Interconnector
Layer Count: 4-20 Layers
Layer Count: 4-20 Layers
Pcb Name: 4L 1+N+1 HDI Boards
Special Request: Half Hole, 0.25mm BGA
Impedance Control: Yes
Pcb Name: 4L 1+N+1 HDI Boards
Thickness: 0.4-3.2mm
Hole Size: 0.1mm Laser Drill
Minimum Hole Size: 0.15mm
Special Requirements: Multiclass Impedance
Surface Mount Technology: Yes
Size: /
Copper Thickness: 0.5oz-6oz
Packing: Vacuum Packing With Carton Box
Layers: 4-22 Layer
Size: /
Copper Thickness: 0.5oz-6oz
Size: /
Special Requirements: Multiclass Impedance
Special Requirements: Multiclass Impedance
Number Of Layers: 4-32 Layers
Surface Mount Technology: Yes
Min. Hole Size: 0.2mm
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