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IMS PCB Insulation Sheet with Ventec Materials 0.5oz Copper ISO Certified

Service: PCB Fabrication

Copper Thickness: 0.5-6.0oz

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Ventec IMS PCB Base Board with Custom Surface Finish 1 Layer Printed Circuit Board ISO Certified

Type: Insulation Sheet,PCB Base Board

Surface Finishing: CUSTOM

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Compact Insulated Metal Substrate PCB Fabrication 0.6mm-6.0MM Thickness

Type: Insulation Sheet,PCB Base Board

Sample: Avaliable

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High Performance ENIG Ceramic Substrate PCB Nickel Palladium GLOD Surface Technics

Size: 2mm~200mm

Min Line Width/Spacing: 0.1mm

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Size 22mm*19mm Multilayer Ceramic Printed Circuit Board For PCB PCBA OEM

Min Line Width/Spacing: 0.1mm

Surface Technics: ENIG,nickel-palladium GLOD

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High Density HDI PCB Board With Half Hole BGA 0.25mm Lamp Socket 10 1 Aspect Ratio

Special Request: Half Hole, 0.25mm BGA

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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20 Layer PCB Board With Multigroup Impedance Control VIPPO Under Paste TU-933

Layer Count: 4-20 Layers

Minimum Hole Size: 0.15mm

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Thickness 0.4-3.2mm HDI PCB Board 6-32L Impedance Control 100% E Testing

Key Words: High Density Interconnector

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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8mil-126mil Thickness High Density PCB HDI Circuit Board 4-20 Layers

Raw Material: FR4 IT180

Pcb Name: 4L 1+N+1 HDI Boards

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OEM HDI Circuit Board 10 Layer 2+N+2 X Ray Tested Ultra Thin 0.2mm-6.00mm

Aspect Ratio: 10:1

Minimum Hole Size: 0.15mm

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FR4 TU-872 Hight Speed PCB 10 Layers 3/3Mil PCB 4L 1 N 1 HDI Boards ENIG IP4452

Min Trace: 3/3Mil

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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6-32L HDI PCB Design 0.2mm-6.0mm Thickness Half Hole Bga Feature

Special Requirements: Lamp Socket

Aspect Ratio: 10:1

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Industrial High Density Interconnect PCB 4-20Layers 0.4-3.2mm Thickness

Minimum Hole Size: 0.15mm

Testing: 100%E-Testing,X-RAY

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6 Layers Lamp Socket HDI Rigid Flex PCB Half Hole 3/3Mil Impedance Control

Hole Size: 0.1mm Laser Drill

Special Requirements: Lamp Socket

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