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Wear Resistant Ceramic PCB Board With DFM And High Thermal Conductivity

Wear Resistant Ceramic PCB Board With DFM And High Thermal Conductivity

Ceramic PCB Board With DFM

ceramic substrate pcb With DFM

Wear Resistant Ceramic PCB Board

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Product Details
Min Line Width/Spacing:
One-stop Service / OEM,DFM
Surface Finished:
Immersion Gold,nickel-palladium GLOD
Surface Technics:
ENIG,nickel-palladium GLOD
Dielectric Constant:
Pcb Size:
Thermal Conductivity:
170 W/mK
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Product Description

0.1mm Min Line Width/Spacing Ceramic PCB Board with DFM and High Thermal Conductivity

Product Description:

The Ceramic PCB Board stands at the pinnacle of electronic circuit board technology, embodying a perfect blend of durability and high performance. This product is meticulously engineered to cater to the needs of high-end electronics where thermal management is critical. With an operating temperature range from -50°C to 150°C, this PCB is designed to withstand extreme conditions, making it an ideal solution for applications in demanding environments.

Constructed from premium materials such as Aluminum Oxide (Al2O3) and Aluminum Nitride (ALN), the Ceramic PCB Board showcases exceptional thermal properties. Al2O3 is renowned for its electrical insulation capabilities, while ALN is celebrated for its outstanding thermal conductivity, which is crucial in the dissipation of heat. This combination of materials ensures that the Ceramic PCB Board is not only robust but also highly efficient in managing thermal stresses.

The dimensions of this Ceramic PCB Board range from a compact 2mm to an expansive 200mm, accommodating a versatile array of design specifications and applications. Whether it's for a small-scale electronic device or a large industrial component, this PCB offers the perfect substrate size to meet your requirements.

Flexibility in design is further enhanced by the option of 1 to 8 layers, providing ample space for complex circuits and components. The multi-layered structure allows for a higher density of interconnections, making the Ceramic PCB Board the substrate of choice for sophisticated electronics where space is at a premium. This versatility in layering opens up a myriad of possibilities for electronic design engineers to innovate without constraints.

One of the most compelling features of the Ceramic PCB Board is its thermal conductivity, boasting an impressive 170 W/mK. This high thermal conductivity Ceramic PCB ensures that heat generated by electronic components is quickly and efficiently transferred away from critical parts, thereby enhancing the performance and longevity of the device. This characteristic positions the Ceramic PCB Board as a leading Ceramic Thermal Management PCB solution in the market.

The high thermal conductivity Ceramic PCBs are not only effective in managing heat but also contribute to reducing the overall system's thermal footprint. By efficiently dissipating heat, these PCBs help maintain optimal operating temperatures, which is vital for the reliability and stability of electronic systems. The Ceramic PCB Board's superior thermal management capability makes it a top choice for applications such as high-power LEDs, power converters, and automotive electronics, where heat dissipation is a significant concern.

Moreover, the robust nature of the Ceramic PCB Board's material composition ensures that it is resistant to thermal shocks, chemical corrosion, and mechanical wear. Such resilience is particularly important in applications where the PCB is exposed to harsh chemicals or subject to frequent temperature fluctuations. The durability of the Ceramic PCB Board translates into a longer lifespan for the device it supports, reducing maintenance costs and downtime.

In conclusion, the Ceramic PCB Board is the epitome of high-performance circuitry. Its ability to operate within a wide temperature range, combined with high thermal conductivity and multi-layer configurations, makes it a leading choice for engineers and designers. As a Ceramic Thermal Management PCB, it presents a reliable solution for managing heat in complex electronics, ensuring that devices not only meet but exceed performance expectations. The Ceramic PCB Board is truly a cornerstone in the advancement of high thermal conductivity Ceramic PCBs, setting a new standard for excellence in electronic component design.



  • Product Name: Ceramic PCB Board
  • Product Type: PCB&PCBAOEM, DFM
  • Surface Finished: Immersion Gold, nickel-palladium GLOD
  • Material: Al2O3, ALN
  • Pcb Size: 22mm*19mm
  • Size Range: 2mm~200mm
  • Technologies: Ceramic Substrate PCB, DBC (Direct Bond Copper), DPC (Direct Plated Copper)
  • Advanced Ceramic PCB Types: LTCC (Low Temperature Co-fired Ceramic), HTCC (High Temperature Co-fired Ceramic)
  • Special Feature: Ceramic Glass Composite PCB

Technical Parameters:

Parameter Specification
Solder Mask Colour Black
Layers 1-8 Layers
Pcb Size 22mm*19mm
Operating Temperature -50°C To 150°C
Thermal Conductivity 170 W/mK
Surface Technics ENIG, nickel-palladium GLOD
Material Al2O3, ALN
Surface Finished Immersion Gold, nickel-palladium GLOD
Size 2mm~200mm


The Ceramic Printed Circuit Board (PCB) made from high-quality materials such as Al2O3 and ALN (Aluminum Nitride) is a crucial component for various high-tech applications. The exceptional thermal conductivity of this board, standing at 170 W/mK, makes it ideal for scenarios where heat dissipation is of utmost importance. These ceramic PCBs come in various types such as Direct Bond Copper (DBC), Direct Plated Copper (DPC), Low-Temperature Co-fired Ceramic (LTCC), and High-Temperature Co-fired Ceramic (HTCC), each designed to cater to different application requirements.

With the provision of one-stop service and Original Equipment Manufacturer (OEM) solutions, as well as Design for Manufacturability (DFM) support, these ceramic PCBs are perfectly suited for industries that require a high degree of customization and precision engineering. The minimal line width and spacing capability of 0.1mm ensure high-density interconnections and compact designs, which are essential in modern electronic devices. Surface technics like Electroless Nickel Immersion Gold (ENIG) and nickel-palladium gold (GLOD) provide a reliable and durable finish that is vital for long-term performance.

Common application occasions for Ceramic PCBs include high-frequency electronics where DBC and DPC technologies are particularly beneficial due to their excellent electrical insulation properties and thermal stability. In aerospace and defense industries, the robustness of LTCC and HTCC boards is critical for equipment that must withstand extreme environmental conditions. Additionally, the medical field utilizes these ceramic PCBs for diagnostic and treatment equipment where precision and reliability are non-negotiable.

Furthermore, the automotive industry is increasingly adopting Ceramic Printed Circuit Boards for sensors and control units due to their ability to operate reliably under high-temperature variations. Power electronics, LED lighting, and semiconductor cooling systems also heavily rely on the superior thermal management capabilities of these boards. With the ongoing trend of miniaturization and the need for efficient heat dissipation in electronic devices, the application scenarios for ceramic PCBs are expanding, making them a cornerstone in the advancement of modern technology.



We offer premium Product Customization Services for our Ceramic PCB Board, ensuring that your specific requirements are met with precision. Choose from our options to tailor your PCB to your needs:

Solder Mask Colour: Opt for a sleek Black solder mask to give your Ceramic Substrate PCB a professional and aesthetic finish.

Service: Benefit from our comprehensive One-stop Service / OEM,DFM solutions, designed to streamline the manufacturing process of your Ceramic Dielectric PCB from concept to completion.

Size: Customize the dimensions of your Ceramic PCB Board, with sizes ranging from 2mm up to 200mm, to fit your application perfectly.

Min Line Width/Spacing: Achieve intricate designs with our capability to handle a Min Line Width/Spacing as fine as 0.1mm, ideal for complex and high-density Ceramic Insulated Metal Substrate layouts.

Thermal Conductivity: Ensure superior heat dissipation with a Thermal Conductivity rating of 170 W/mK, making it an excellent choice for high-power and high-temperature applications.


Support and Services:

The Ceramic PCB Board is designed to deliver high-performance and reliability for demanding applications. Our product technical support and services are dedicated to ensuring that you can make the most of your Ceramic PCB Board with confidence and ease. We provide comprehensive support services to address any issues you may encounter and to help optimize your product's performance.

Our technical support includes troubleshooting assistance, guidance on best practices for board handling and use, and recommendations for thermal management and soldering processes. We understand the importance of minimizing downtime, so our experts are committed to providing swift and effective solutions to any technical challenges you may face.

Additionally, we offer a range of services to support the lifecycle of your Ceramic PCB Board. These services include diagnostic evaluations, repair or replacement options, and advice on upgrades or enhancements to ensure your product remains at the forefront of technology. Our goal is to provide you with the resources and support necessary for a smooth and successful experience with our Ceramic PCB Board.

Please note that our technical support and services are subject to our terms of service and may require proof of purchase or registration of your product. We are dedicated to your satisfaction and are here to help you maximize the benefits of your Ceramic PCB Board.

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