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Superior Heat Dissipation Ceramic Substrate PCB 2mm-200mm Thickness

Size: 2mm~200mm

Service: One-stop Service / OEM,DFM

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High Performance ENIG Ceramic Substrate PCB Nickel Palladium GLOD Surface Technics

Size: 2mm~200mm

Min Line Width/Spacing: 0.1mm

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Immersive Ceramic Substrate PCB With Thermal Conductivity 0.1mm Min Line 1-8 Layers

Thermal Conductivity: 170 W/mK

Min Line Width/Spacing: 0.1mm

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2-Layer 0.2mm ENIG Ceramic Substrate PCB Boards 0.1mm Trace 150.C Max Temp

Thickness: 0.2mm

Layers: 2

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Green ENIG Surface Finish Ceramic IC Substrate PCB Dual Layered With 0.1mm Trace

Rohs Compliant: Yes

Minimum Trace Width: 0.1mm

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OEM Precision Ceramic Multilayer PCB With 0.1mm Min Line Immersion Gold Surface

Layers: 1-8 Layers

Min Line Width/Spacing: 0.1mm

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Black Solder Mask Ceramic PCB Board Manufacturing One Stop Service

Thermal Conductivity: 170 W/mK

Solder Mask Colour: Black

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OEM ODM Ceramic PCB Board With Black Solder Mask High Dielectric Constant

Min Line Width/Spacing: 0.1mm

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Durable Density Ceramic IC Substrate PCB Ultra Thin 0.2mm 0.1mm Trace Materials BT

Minimum Trace Spacing: 0.1mm

Substrate Type: Rigid

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ENIG Surface Finish Ceramic or BT Rigid IC Substrate PCB 1oz Copper Weight

Thickness: 0.2mm

Minimum Hole Size: 0.2mm

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1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board

Substrate Type: Rigid

Minimum Hole Size: 0.2mm

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Wear Resistant Ceramic PCB Board With DFM And High Thermal Conductivity

Min Line Width/Spacing: 0.1mm

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DFM Multilayer Ceramic PCB With Immersion Gold Technology Enig Finish Temp Resistant

Pcb Name: Immersion Gold Ceramic PCB Board

Surface Finished: Immersion Gold,nickel-palladium GLOD

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ENIG Surface Ceramic PCB Board Min Line 0.1mm Temp Range -50.C To 150.C

Product Type: PCB&PCBAOEM,DFM

Min Line Width/Spacing: 0.1mm

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High Thermal Conductivity Ceramic PCBs Al2O3 ALN Immersion Gold Finish

Operating Temperature: -50°C To 150°C

Surface Finished: Immersion Gold,nickel-palladium GLOD

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ENIG Surface Finish IC Substrate PCB IC Circuit Board 0.2mm Basic material BT HF HTG

Surface Finish: ENIG

Minimum Hole Size: 0.2mm

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Superior Heat Dissipation Ceramic Substrate PCB 2mm-200mm Thickness

High Performance ENIG Ceramic Substrate PCB Nickel Palladium GLOD Surface Technics

Immersive Ceramic Substrate PCB With Thermal Conductivity 0.1mm Min Line 1-8 Layers

2-Layer 0.2mm ENIG Ceramic Substrate PCB Boards 0.1mm Trace 150.C Max Temp

Green ENIG Surface Finish Ceramic IC Substrate PCB Dual Layered With 0.1mm Trace

OEM Precision Ceramic Multilayer PCB With 0.1mm Min Line Immersion Gold Surface

Black Solder Mask Ceramic PCB Board Manufacturing One Stop Service

OEM ODM Ceramic PCB Board With Black Solder Mask High Dielectric Constant

Durable Density Ceramic IC Substrate PCB Ultra Thin 0.2mm 0.1mm Trace Materials BT

ENIG Surface Finish Ceramic or BT Rigid IC Substrate PCB 1oz Copper Weight

1oz Copper Weight Package Substrate PCB IC PCB Board Rohs Approval BT board

Wear Resistant Ceramic PCB Board With DFM And High Thermal Conductivity

DFM Multilayer Ceramic PCB With Immersion Gold Technology Enig Finish Temp Resistant

ENIG Surface Ceramic PCB Board Min Line 0.1mm Temp Range -50.C To 150.C

High Thermal Conductivity Ceramic PCBs Al2O3 ALN Immersion Gold Finish

ENIG Surface Finish IC Substrate PCB IC Circuit Board 0.2mm Basic material BT HF HTG