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high density interconnect pcb Online Manufacturer

high density interconnect pcb (170)  Online Manufacturer

100%E-Testing Glass Epoxy PCB Board with Blind And Buried Vias and Immersion Surface

Blind And Buried Vias: Available

Thickness: 0.4-3.2mm

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Enig Surface Finish Rigid Flex PCB Assembly Bendable With 1-8 Flexibility

Treatment: ENIG/OSP/Immersion Gold/Tin/Silver

Dimension: 41.55*131mm

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Lead Free ROHS Quick Turn PCB Prototype 5 Day Turn 4 - Layer Samples

Service: One-stop Service OEM

Glass Epoxy: RO4003C+ Tg170 FR-4

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32 Layer PCB Multiclass Impedance Multi Layer PCB Board For Big Scale Projects

Special Requirements: Multiclass Impedance

Number Of Layers: 4-32 Layers

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Wear Resistant Ceramic PCB Board With DFM And High Thermal Conductivity

Min Line Width/Spacing: 0.1mm

Service: One-stop Service / OEM,DFM

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22mm*19mm Black Ceramic PCB Board With Thermal Conductivity Al2O3/ALN

Layers: 1-8 Layers

Thermal Conductivity: 170 W/mK

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RoHS Certified White Silkscreen Slp Substrate Like PCB Green Solder Mask

Solder Mask Color: Green

Min. Trace Width/Spacing: 0.1mm

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ABF Material Immersion Gold PCB Substrate Circuit Board With White Silkscreen

Min. Hole Size: 0.2mm

Lead Time: 5-7 Days

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HASL Gold Finger Multilayer PCBs 10 Layer FR4 PCB Board Customization

Copper Weight: 12OZ

Surface Mount Technology: Yes

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Glass Epoxy FR-4 HASL Surface Coating Multilayer PCB Board 12OZ Copper Weight

Min. Hole Size: 0.2mm

Thickness: 0.2mm-6.0mm

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Durable Density Ceramic IC Substrate PCB Ultra Thin 0.2mm 0.1mm Trace Materials BT

Minimum Trace Spacing: 0.1mm

Substrate Type: Rigid

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Double Layers Double Sided PCB with 1-6oz Copper Weight and 0.075mm Min Hole Dia

Silkscreen Color: White,Black,yellow

Sillkscreen: White,Black,yellow

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