high density interconnect pcb (135) Online Manufacturer
Thickness: 0.2mm-6.0mm
Number Of Layers: 4-32 Layers
Surface Finish: ENIG
Minimum Hole Size: 0.2mm
Hole Position Deviation: ±0.05mm
Bend Radius: 0.5-10mm
Thickness: 0.2mm
Layers: 2
Min. Hole Size: 0.2mm
Max. Panel Size: 600mm*1200mm
Feature: 100% E-test
Copper Weight: 1-6oz
Lead Time: 5-7 Days
Silkscreen Color: White
Surface Mount Technology: Yes
Service: One-stop Service OEM
Surface Technics: ENIG,nickel-palladium GLOD
Thermal Conductivity: 170 W/mK
Solder Mask Color: Green
Impedance Control: Yes
Surface Finish: HASL、ENIG、Immersion Tin、Immersion Silver、Gold Finger、OSP
Color: Green, Blue, Yellow
Feature: 100% E-test
Layers: Double
Application: Electronic Devices
Silkscreen Color: White
Aspect Ratio: 10:1
Minimum Hole Size: 0.15mm
Layer Count: 4-20 Layers
Testing: 100%E-Testing,X-RAY
Special Request: Half Hole, 0.25mm BGA
Min Trace: 3/3Mil
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