high density interconnect pcb (170) Online Manufacturer
Blind And Buried Vias: Available
Thickness: 0.4-3.2mm
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Dimension: 41.55*131mm
Minimum Trace Spacing: 0.1mm
Substrate Type: Rigid
Service: One-stop Service OEM
Glass Epoxy: RO4003C+ Tg170 FR-4
Size: /
Thickness: 0.2mm-6.0mm
Special Requirements: Multiclass Impedance
Number Of Layers: 4-32 Layers
Min Line Width/Spacing: 0.1mm
Service: One-stop Service / OEM,DFM
Layers: 1-8 Layers
Thermal Conductivity: 170 W/mK
Solder Mask Color: Green
Min. Trace Width/Spacing: 0.1mm
Layers: 2
Thickness: 0.2mm
Min. Hole Size: 0.2mm
Lead Time: 5-7 Days
Copper Weight: 12OZ
Surface Mount Technology: Yes
Min. Hole Size: 0.2mm
Thickness: 0.2mm-6.0mm
Size: /
Copper Thickness: 0.5oz-6oz
Minimum Trace Spacing: 0.1mm
Substrate Type: Rigid
Silkscreen Color: White,Black,yellow
Sillkscreen: White,Black,yellow
Send your inquiry directly to us