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4 Layer 1 OZ Copper HDI PCB Board with 0.1MM Min Hole Size for Lamp Socket

Pcb Name: 4L 1+N+1 HDI Boards

Minimum Hole Size: 0.15mm

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Foldable Flexible Rigid Pcb Assembly Multi Layered Fr4 Polyimide Pet Technology

No Of Layers: 4 Layer

Max Layer: 52L

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Density Sanforized Rigid Flex PCB Assembly 1-28 Layers 52L 0.5-10mm Bend Radius

Sanforized: Local High Density, Back Drill

Pcb Layer: 1-28layers

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10 Layers Flexible Rigid PCB Assembly With V CUT Routing Immersion Gold Treatment

Profiling Punching: Routing, V-CUT, Beveling

Treatment: ENIG/OSP/Immersion Gold/Tin/Silver

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FR4 IT180 4-20 Layers HDI PCB Board with Multi Impedance Control and 0.1mm Hole Nickel-Palladium BGA 0.2mm

Impedance Control: Yes

Aspect Ratio: 10:1

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LED Screen P1.25 4L 1+N+1 HDI Specialty PCB Board With 0.15mm Minimum Hole Size For Lamp Socket Applications

Minimum Hole Size: 0.15mm

Raw Material: FR4 IT180

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Precise Fr4 Rigid Flex PCB Board With V Cut Routing Enig Treatment

Profiling Punching: Routing, V-CUT, Beveling

Material: FR4, Polyimide, PET

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12-Layer 1200 MM Length IMS PCB with Excellent Tensile Strength and Withstand Voltage of 3KV

Board Thickness: 0.2-6.0mm

Min. Hole Size: 0.2mm

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OEM 6 Layer High Speed Pcb Board With Lamp Socket 0.4-3.2Mm Impedance Control

Pcb Name: 4L 1+N+1 HDI Boards

Thickness: 0.4-3.2mm

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4Layer HDI PCB Board With Impedance Control Density Interconnector X Ray Testing

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

Pcb Name: 4L 1+N+1 HDI Boards

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SMT THT DIP Assembly Process HDI PCB Board with HASL Surface Finish and 0.5oz-6oz Copper Thickness

Thickness: 1.6mm, ±10%

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

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RO4003C Tg170 FR-4 Multilayer PCB Board Rogers PCB Board 12OZ Copper Weight

Packing: Vacuum Packing With Carton Box

Copper Weight: 12OZ

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Bendable Rigid Flex PCB Circuit Boards Fr4 Polyimide Pet Sanforized

Material: FR4, Polyimide, PET

Sanforized: Local High Density, Back Drill

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FR-4 Raw Material Double Layer PCB 1.6mm for Temperature and Voltage Environments

Silkscreen Color: White,Black，yellow

Min Hole Dia: 0.075 Mm

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Advanced SMT THT DIP SMT PCB Assembly with HDI PCB Board and Min. Solder Mask Bridge 0.075mm

Copper Thickness: 0.5oz-6oz

Pcb Assembly Process: SMT THT DIP SMT PCB Assembly

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1-8 Times Bending Rigid Flex PCB FR4 Polyimide PET 52L 1-28layers ENIG OSP Silver

Max Layer: 52L

Material: FR4, Polyimide, PET

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High Density Interconnector High Speed PCB Board with Minimum Hole Size as Small as 0.15mm

4L 6L High Density HDI PCB Board With Impedance Control Half Hole

Ultra Thin 4L1+N+1 High Density PCB Intricate Electronic Designs HDI PCB Prototype

100% Electrical Test Prior Shipment High Density Model Board with 10 1 Aspect Ratio

4 Layer 1 OZ Copper HDI PCB Board with 0.1MM Min Hole Size for Lamp Socket

Foldable Flexible Rigid Pcb Assembly Multi Layered Fr4 Polyimide Pet Technology

Density Sanforized Rigid Flex PCB Assembly 1-28 Layers 52L 0.5-10mm Bend Radius

10 Layers Flexible Rigid PCB Assembly With V CUT Routing Immersion Gold Treatment

FR4 IT180 4-20 Layers HDI PCB Board with Multi Impedance Control and 0.1mm Hole Nickel-Palladium BGA 0.2mm

LED Screen P1.25 4L 1+N+1 HDI Specialty PCB Board With 0.15mm Minimum Hole Size For Lamp Socket Applications

Precise Fr4 Rigid Flex PCB Board With V Cut Routing Enig Treatment

12-Layer 1200 MM Length IMS PCB with Excellent Tensile Strength and Withstand Voltage of 3KV

OEM 6 Layer High Speed Pcb Board With Lamp Socket 0.4-3.2Mm Impedance Control

4Layer HDI PCB Board With Impedance Control Density Interconnector X Ray Testing

SMT THT DIP Assembly Process HDI PCB Board with HASL Surface Finish and 0.5oz-6oz Copper Thickness

RO4003C Tg170 FR-4 Multilayer PCB Board Rogers PCB Board 12OZ Copper Weight

Bendable Rigid Flex PCB Circuit Boards Fr4 Polyimide Pet Sanforized

FR-4 Raw Material Double Layer PCB 1.6mm for Temperature and Voltage Environments

Advanced SMT THT DIP SMT PCB Assembly with HDI PCB Board and Min. Solder Mask Bridge 0.075mm

1-8 Times Bending Rigid Flex PCB FR4 Polyimide PET 52L 1-28layers ENIG OSP Silver