high density interconnect pcb (135) Online Manufacturer
Material: FR4, Polyimide, PET
Sanforized: Local High Density, Back Drill
Max Layer: 52L
No Of Layers: 4 Layer
Lead Time: 2-5 Days
Min. Annular Ring: 3mil
Raw Material: FR4 IT180
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Raw Material: Fr - 4
Shipping: DHL UPS EMS TNT FedEx,Express Courier,Sea Transport
Min. Annular Ring: 3mil
Layer Count: Any Layer
Min. Annular Ring: 3mil
Layer Count: Any Layer
Min. Annular Ring: 3mil
Solder Mask Color: Green, Red, Blue, Black, Yellow, White
Layer Count: Any Layer
Testing: Flying Probe Test, E-test
Raw Material: FR4 IT180
Layer Count: 4-20 Layers
Number Of Layers: 4-22 Layers
Packing: Vacuum Packing With Carton Box
Silkscreen Color: White,Black,yellow
Sillkscreen: White,Black,yellow
Pcb Thickness: 1.6mm
Raw Material: Fr - 4
Surface Mount Technology: Yes
Packing: Vacuum Packing With Carton Box
ISO Certification: ISO 9001:2015, ISO 14001:2015, ISO 13485:2016
Min. Line Width/Spacing: 0.075/0.075mm
Silkscreen Color: White,Black,yellow
Shipping: DHL UPS EMS TNT FedEx,Express Courier,Sea Transport
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