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FR4/Polyimide/PET White Solder Mask FPC Circuit Board Bendable Circuit Board OEM

Material: FR4, Polyimide, PET

Pcb Layer: 1-28layers

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Four Layer Rigid Flexible Printed Circuit Board SMD BGA DIP Components 1-8 Flexibility

Material: FR4, Polyimide, PET

Flexibility: 1-8 Times

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Impedance Control Test Multilayer Circuit Board with 0.4mm Board Thickness

Thickness Of Copper: 0.5-14oz (18-490um)

Pcb: Single,double,multilayer Pcb,custom Pcb

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Final Foil External 1.oz Multilayer Printed Board 2-30 Layer Count for Products

Pcb: Single,double,multilayer Pcb,custom Pcb

Final Foil External: 1.oz

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4L 1 N 1 HDI Boards Special Request Half Hole HDI Printed Circuit Boards for Customized Needs and 10 1 Aspect Ratio

Aspect Ratio: 10:1

Impedance Control: Yes

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FR4 IT180 Raw Material 4L 1 N 1 HDI Printed Circuit Boards prototype for Products quick turn

Special Request: Half Hole, 0.25mm BGA

Aspect Ratio: 10:1

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4-32 Layers Multilayer Printed Circuit Board and Thickness 0.2mm-6.0mm for Advanced Applications

Number Of Layers: 4-32 Layers

Service: One-stop Service OEM

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Efficiently-designed HDI Printed Circuit Boards with Immersion Gold Process and P1.5 Spacing

Min. Bga Pitch: 0.3mm

Impedance Control: +/-10%

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White Silk HDI Printed Circuit Boards 0.4-3.2mm Thickness for Performance and Durability

Smallest Hole Size: 0.1mm

Min Via: 0.1mm

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Max. Panel Size 600mm*1200mm Multilayer Printed Circuit Board for Customer Requirements

Min. Hole Size: 0.2mm

Copper Thickness: 0.5oz-6oz

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Conductor Space 3 Mil Dual-Sided Printed Wiring Board for Tight Tolerance Requirements

Sillkscreen: White,Black，yellow

Conductor Space: 3 Mil

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Immersion Gold Two-Sided Circuit Board with Copper Weight 1-6oz

Surface Treatment: Immersion Gold

Surface Finish: HASL、ENIG、Immersion Tin、Immersion Silver、Gold Finger、OSP

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SMT and Surface Mount Technology Multilayer Printed Circuit Board with 6 Layers

Type Of Assembly: SMT, Thru-hole

Soldermask: Green

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Hole Position Deviation ±0.05mm Flexible Rigid Printed Circuit Board for SMD Components

Profiling Punching: Routing, V-CUT, Beveling

Bend Radius: 0.5-10mm

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High Density Interconnector HDI Printed Circuit Boards with Min Trace 3/3Mil

Rigid And Flexible Pcb Local Density Hasl Lf Treatment Immersion Gold Finish

High Aspect Ratio 10 1 HDI PCB Board with P1.5 Spacing and 0.3mm Min. Bga Pitch

Customizable Glass Epoxy HDI PCB with 10 1 Aspect Ratio and OSP Surface Finish

FR4/Polyimide/PET White Solder Mask FPC Circuit Board Bendable Circuit Board OEM

Four Layer Rigid Flexible Printed Circuit Board SMD BGA DIP Components 1-8 Flexibility

Impedance Control Test Multilayer Circuit Board with 0.4mm Board Thickness

Final Foil External 1.oz Multilayer Printed Board 2-30 Layer Count for Products

4L 1 N 1 HDI Boards Special Request Half Hole HDI Printed Circuit Boards for Customized Needs and 10 1 Aspect Ratio

FR4 IT180 Raw Material 4L 1 N 1 HDI Printed Circuit Boards prototype for Products quick turn

4-32 Layers Multilayer Printed Circuit Board and Thickness 0.2mm-6.0mm for Advanced Applications

Efficiently-designed HDI Printed Circuit Boards with Immersion Gold Process and P1.5 Spacing

White Silk HDI Printed Circuit Boards 0.4-3.2mm Thickness for Performance and Durability

Max. Panel Size 600mm*1200mm Multilayer Printed Circuit Board for Customer Requirements

Conductor Space 3 Mil Dual-Sided Printed Wiring Board for Tight Tolerance Requirements

Immersion Gold Two-Sided Circuit Board with Copper Weight 1-6oz

SMT and Surface Mount Technology Multilayer Printed Circuit Board with 6 Layers

Hole Position Deviation ±0.05mm Flexible Rigid Printed Circuit Board for SMD Components