high density interconnect pcb (135) Online Manufacturer
Minimum Hole Size: 0.15mm
Testing: 100%E-Testing,X-RAY
Raw Material: FR4 IT180
Impedance Control: Yes
Thickness: 0.4-3.2mm
Layer Count: 4-20 Layers
Packing: Vacuum Packing With Carton Box
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Board Layer: 6-32L
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Special Request: Half Hole, 0.25mm BGA
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Layer Count: 4-20 Layers
Hole Size: 0.1mm Laser Drill
Testing: 100%E-Testing,X-RAY
Pcb Name: 4L 1+N+1 HDI Boards
Pcb Name: 4L 1+N+1 HDI Boards
Special Requirements: Lamp Socket
Raw Material: FR4 IT180
Layer Count: 4-20 Layers
Special Requirements: Multiclass Impedance
Surface Mount Technology: Yes
Impedance Control: Yes
Hole Size: 0.1mm Laser Drill
Pcb Name: 4L 1+N+1 HDI Boards
Key Words: High Density Interconnector
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Raw Material: FR4 IT180
Pcb Name: 4L 1+N+1 HDI Boards
Pcb Name: 4L 1+N+1 HDI Boards
Raw Material: FR4 IT180
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