high density interconnect pcb (170) Online Manufacturer
Raw Material: FR4 IT180
Impedance Control: Yes
Minimum Hole Size: 0.15mm
Testing: 100%E-Testing,X-RAY
Thickness: 0.4-3.2mm
Layer Count: 4-20 Layers
Packing: Vacuum Packing With Carton Box
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Board Layer: 6-32L
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Special Request: Half Hole, 0.25mm BGA
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Layer Count: 4-20 Layers
Hole Size: 0.1mm Laser Drill
Testing: 100%E-Testing,X-RAY
Pcb Name: 4L 1+N+1 HDI Boards
Pcb Name: 4L 1+N+1 HDI Boards
Special Requirements: Lamp Socket
Material: FR-4
Solder Mask Color: Green, Red, Blue, Black, Yellow, White
Raw Material: FR4 IT180
Layer Count: 4-20 Layers
Special Requirements: Multiclass Impedance
Surface Mount Technology: Yes
Raw Material: FR4 IT180
Thickness: 0.4-3.2mm
Impedance Control: Yes
Hole Size: 0.1mm Laser Drill
Pcb Name: 4L 1+N+1 HDI Boards
Key Words: High Density Interconnector
Impedance Control: +/-10%
Misalignment Of Layers: +/- 0.06
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