high density interconnect pcb (107) Online Manufacturer
Raw Material: FR4 IT180
Impedance Control: Yes
Minimum Hole Size: 0.15mm
Testing: 100%E-Testing,X-RAY
Packing: Vacuum Packing With Carton Box
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Special Request: Half Hole, 0.25mm BGA
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Layer Count: 4-20 Layers
Hole Size: 0.1mm Laser Drill
Raw Material: FR4 IT180
Pcb Name: 4L 1+N+1 HDI Boards
Impedance Control: Yes
Hole Size: 0.1mm Laser Drill
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Material: FR-4
Minimum Line Width/Spacing: 3mil/3mil
Pcb Name: 4L 1+N+1 HDI Boards
Raw Material: FR4 IT180
Key Words: High Density Interconnector
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Pcb Name: 4L 1+N+1 HDI Boards
Thickness: 0.4-3.2mm
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Pcb Name: 4L 1+N+1 HDI Boards
Layer Count: 4-20 Layers
Minimum Hole Size: 0.15mm
Raw Material: FR4 IT180
Pcb Name: 4L 1+N+1 HDI Boards
Minimum Hole Size: 0.1mm
Lead Time: 2-5 Days
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