high density interconnect pcb (170) Online Manufacturer
ISO Certification: ISO 9001:2015, ISO 14001:2015, ISO 13485:2016
Min. Line Width/Spacing: 0.075/0.075mm
Layers: Double
Solder Resist Color: Green
Layers: 4-22 Layer
Packing: Vacuum Packing With Carton Box
Thickness: 0.2mm-6.0mm
Number Of Layers: 4-32 Layers
Surface Finish: ENIG
Minimum Hole Size: 0.2mm
Hole Position Deviation: ±0.05mm
Bend Radius: 0.5-10mm
Thickness: 0.2mm
Layers: 2
Min. Hole Size: 0.2mm
Max. Panel Size: 600mm*1200mm
Feature: 100% E-test
Copper Weight: 1-6oz
Surface Mount Technology: Yes
Service: One-stop Service OEM
Lead Time: 5-7 Days
Silkscreen Color: White
Surface Technics: ENIG,nickel-palladium GLOD
Thermal Conductivity: 170 W/mK
Solder Mask Color: Green
Impedance Control: Yes
Surface Finish: HASL、ENIG、Immersion Tin、Immersion Silver、Gold Finger、OSP
Color: Green, Blue, Yellow
Silkscreen Color: White,Black,yellow
Shipping: DHL UPS EMS TNT FedEx,Express Courier,Sea Transport
Application: Electronic Devices
Silkscreen Color: White
Send your inquiry directly to us