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high density interconnect pcb (170) Online Manufacturer

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FR4 IT180 18Layers 3+N+3 HDI PCB Board prototype With Crimp Hole 3/3Mil Traces X RAY Tested HDI quickturn ENIG

Raw Material: FR4 IT180

Pcb Name: 4L 1+N+1 HDI Boards

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Yes Impedance Control HDI PCB Board with Half Hole and 0.15mm Minimum Hole Size

Testing: 100%E-Testing,X-RAY

Thickness: 0.4-3.2mm

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0.1mm Laser Drill Hole Size HDI PCB Board for Density Electronic Devices Thickness 0.4-3.2mm Raw Material FR4 IT180

Layer Count: 4-20 Layers

Testing: 100%E-Testing,X-RAY

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6-32L Board Layer HDI PCB Board Made of FR4 IT180 Raw Material and 0.1mm Laser Drill Hole Size for Applications

Key Words: High Density Interconnector

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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Special Requirements Lamp Socket and 100%E-Testing High Speed PCB Board for Testing

Special Request: Half Hole, 0.25mm BGA

Min Trace: 3/3Mil

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OEM 52Layer Flexible Rigid Pcb Printed Wiring Board Smd/Bga/Dip Components

Max Layer: 52L

Hole Position Deviation: ±0.05mm

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Multigroup Impedance Control 6-32L HDI PCB Board FR4 TU-933 Customized

Key Words: High Density Interconnector

Special Requirements: Lamp Socket

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High Density Interconnector HDI Printed Circuit Boards with Min Trace 3/3Mil

Key Words: High Density Interconnector

Testing: 100%E-Testing,X-RAY

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6 Layers Lamp Socket HDI Rigid Flex PCB Half Hole 3/3Mil Impedance Control

Hole Size: 0.1mm Laser Drill

Special Requirements: Lamp Socket

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Rigid And Flexible Pcb Local Density Hasl Lf Treatment Immersion Gold Finish

Flexibility: 1-8 Times

Surface Finishing: HASL LF

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High Aspect Ratio 10 1 HDI PCB Board with P1.5 Spacing and 0.3mm Min. Bga Pitch

Blind Vias: Yes

Key Words: High Density Interconnector

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Customizable Glass Epoxy HDI PCB with 10 1 Aspect Ratio and OSP Surface Finish

Copper Thickness: 0.5oz-6oz

Key Words: High Density Interconnector

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Immersion Surface High Speed PCB Board with 0.15mm Inner Layer Spacing and 8 Layer Multilayer Design of 0.4-3.2mm Thickness

Thickness: 0.4-3.2mm

Blind And Buried Vias: Available

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6 Layer Impedance Control HDI Multilayer Pcb 0.2mm-6.00mm Thickness 1+N+1

Impedance Control: Yes

Hole Size: 0.1mm Laser Drill

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FR4 TU-872 Hight Speed PCB 10 Layers 3/3Mil PCB 4L 1 N 1 HDI Boards ENIG IP4452

Min Trace: 3/3Mil

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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6-32 Layer HDI PCB Manufacturing With 0.25mm BGA And Half Hole For Lamp Socket 20 Layers Tuc TU-933 High Speed PCB

Aspect Ratio: 10:1

Key Words: High Density Interconnector

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high density interconnect pcb Online Manufacturer

HDI PCB Board

Multilayer PCB Board

Rogers PCB Board

Rigid Flex PCB

Ceramic PCB Board

HDI Any Layer PCBs

IC Substrate PCBs

Substrate Like PCBs

Heavy Copper PCB

IMS PCB

Double Sided PCB

4 Layer High Density Interconnect HDI PCB , 6-32L HDI Quick Turn PCB

FR-4 High Density Interconnect Any Layer PCB with Minimum Hole Size of 0.1mm,Panasonic MEGTRON 7,M8,M9,Multiple lamination

18L HDI Density Interconnect Board Min Trace 3/3 Mil Up To 20 Layer FR4 With Lamp Socket VIPPO ENIG+Gold Finger

Multiclass Impedance Multilayer PCB With Copper Thickness 0.5oz-6oz 4-32 Layers High Density Interconnect HDI

FR4 IT180 18Layers 3+N+3 HDI PCB Board prototype With Crimp Hole 3/3Mil Traces X RAY Tested HDI quickturn ENIG

Yes Impedance Control HDI PCB Board with Half Hole and 0.15mm Minimum Hole Size

0.1mm Laser Drill Hole Size HDI PCB Board for Density Electronic Devices Thickness 0.4-3.2mm Raw Material FR4 IT180

6-32L Board Layer HDI PCB Board Made of FR4 IT180 Raw Material and 0.1mm Laser Drill Hole Size for Applications

Special Requirements Lamp Socket and 100%E-Testing High Speed PCB Board for Testing

OEM 52Layer Flexible Rigid Pcb Printed Wiring Board Smd/Bga/Dip Components

Multigroup Impedance Control 6-32L HDI PCB Board FR4 TU-933 Customized

High Density Interconnector HDI Printed Circuit Boards with Min Trace 3/3Mil

6 Layers Lamp Socket HDI Rigid Flex PCB Half Hole 3/3Mil Impedance Control

Rigid And Flexible Pcb Local Density Hasl Lf Treatment Immersion Gold Finish

High Aspect Ratio 10 1 HDI PCB Board with P1.5 Spacing and 0.3mm Min. Bga Pitch

Customizable Glass Epoxy HDI PCB with 10 1 Aspect Ratio and OSP Surface Finish

Immersion Surface High Speed PCB Board with 0.15mm Inner Layer Spacing and 8 Layer Multilayer Design of 0.4-3.2mm Thickness

6 Layer Impedance Control HDI Multilayer Pcb 0.2mm-6.00mm Thickness 1+N+1

FR4 TU-872 Hight Speed PCB 10 Layers 3/3Mil PCB 4L 1 N 1 HDI Boards ENIG IP4452

6-32 Layer HDI PCB Manufacturing With 0.25mm BGA And Half Hole For Lamp Socket 20 Layers Tuc TU-933 High Speed PCB