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high density interconnect pcb (135)  Online Manufacturer

Precise Fr4 Rigid Flex PCB Board With V Cut Routing Enig Treatment

Profiling Punching: Routing, V-CUT, Beveling

Material: FR4, Polyimide, PET

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Density Sanforized Rigid Flex PCB Assembly 1-28 Layers 52L 0.5-10mm Bend Radius

Sanforized: Local High Density, Back Drill

Pcb Layer: 1-28layers

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OEM 6 Layer High Speed Pcb Board With Lamp Socket 0.4-3.2Mm Impedance Control

Pcb Name: 4L 1+N+1 HDI Boards

Thickness: 0.4-3.2mm

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4Layer HDI PCB Board With Impedance Control Density Interconnector X Ray Testing

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

Pcb Name: 4L 1+N+1 HDI Boards

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RO4003C Tg170 FR-4 Multilayer PCB Board Rogers PCB Board 12OZ Copper Weight

Packing: Vacuum Packing With Carton Box

Copper Weight: 12OZ

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Bendable Rigid Flex PCB Circuit Boards Fr4 Polyimide Pet Sanforized

Material: FR4, Polyimide, PET

Sanforized: Local High Density, Back Drill

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FR-4 Raw Material Double Layer PCB 1.6mm for Temperature and Voltage Environments

Silkscreen Color: White,Black,yellow

Min Hole Dia: 0.075 Mm

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4Layer Smd Components Flexrigid Pcb Bendable Circuit Board Hasl Lf Surface Finish

Pcb Layer: 1-28layers

No Of Layers: 4 Layer

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1-8 Times Bending Rigid Flex PCB FR4 Polyimide PET 52L 1-28layers ENIG OSP Silver

Max Layer: 52L

Material: FR4, Polyimide, PET

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Durable Rigid Flex PCB Circuit Board With Silver Treatment Enig Surface Fr4

Treatment: ENIG/OSP/Immersion Gold/Tin/Silver

Surface Finishing: HASL LF

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Good Flexibility Flex Rigid Pcb Assembly 52L Max Layer Bend Radius 0.5-10Mm

Bend Radius: 0.5-10mm

Product Type: PCB Assembly

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High Performance ENIG Ceramic Substrate PCB Nickel Palladium GLOD Surface Technics

Size: 2mm~200mm

Min Line Width/Spacing: 0.1mm

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4 Layers Rigid And Flex Pcb Assembly Enig Treatment 1-28Layers

Pcb Layer: 1-28layers

Product Type: PCB Assembly

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Advanced Thermal Conductivity Ceramic PCB Board Immersion Gold

Product Type: PCB&PCBAOEM,DFM

Dielectric Constant: 6.0-10.0

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