high density interconnect pcb (135) Online Manufacturer
Profiling Punching: Routing, V-CUT, Beveling
Material: FR4, Polyimide, PET
No Of Layers: 4 Layer
Max Layer: 52L
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Minimum Hole Size: 0.15mm
Raw Material: FR4 IT180
Pcb Name: 4L 1+N+1 HDI Boards
Thickness: 0.4-3.2mm
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Pcb Name: 4L 1+N+1 HDI Boards
Packing: Vacuum Packing With Carton Box
Copper Weight: 12OZ
Material: FR4, Polyimide, PET
Sanforized: Local High Density, Back Drill
Silkscreen Color: White,Black,yellow
Min Hole Dia: 0.075 Mm
Pcb Layer: 1-28layers
No Of Layers: 4 Layer
Max Layer: 52L
Material: FR4, Polyimide, PET
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Surface Finishing: HASL LF
Bend Radius: 0.5-10mm
Product Type: PCB Assembly
Size: 2mm~200mm
Min Line Width/Spacing: 0.1mm
Pcb Layer: 1-28layers
Product Type: PCB Assembly
Product Type: PCB&PCBAOEM,DFM
Dielectric Constant: 6.0-10.0
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