high density interconnect pcb (170) Online Manufacturer
Mini Holes: 0.1mm
Min. Solder Mask Bridge: 0.075mm
Surface Mount Technology: Available
Thickness: 1.6mm, ±10%
Min Trace: 3/3Mil
Pcb Thickness: 1.6mm
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Raw Material: FR4 IT180
Pcb Name: 4L 1+N+1 HDI Boards
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Hole Size: 0.1mm Laser Drill
Impedance Control: +/-10%
Bga: 10MIL
Minimum Hole Size: 0.15mm
Pcb Name: 4L 1+N+1 HDI Boards
Aspect Ratio: 10:1
Raw Material: FR4 IT180
Surface Mount Technology: Available
Vip Process: Yes
Pcb Name: 4L 1+N+1 HDI Boards
Raw Material: FR4 IT180
Board Layer: 6-32L
Testing: 100%E-Testing,X-RAY
Material: FR-4
Minimum Line Width/Spacing: 3mil/3mil
Board Layer: 6-32L
Hole Size: 0.1mm Laser Drill
Key Words: High Density Interconnector
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Layer Count: 4-20 Layers
Minimum Hole Size: 0.15mm
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