immersion gold pcb (248) Online Manufacturer
Special Requirements: Multiclass Impedance
Number Of Layers: 4-32 Layers
Surface Mount Technology: Yes
Packing: Vacuum Packing With Carton Box
Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Min Line Width/Spacing: 0.1mm
Service: One-stop Service / OEM,DFM
Material: FR4, Polyimide, PET
Sanforized: Local High Density, Back Drill
Max Layer: 52L
Hole Position Deviation: ±0.05mm
Features: Gerber/PCB File Needed
Finished Copper: 1OZ
Min Line Width/Spacing: 0.1mm
Service: One-stop Service / OEM,DFM
Layer Count: 2
Min Hole Size: 0.2MM
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Impedance Control: +/-10%
Bga: 10MIL
Hole Position Deviation: ±0.05mm
Sanforized: Local High Density, Back Drill
Max Layer: 52L
No Of Layers: 4 Layer
Packing: Vacuum Packing With Carton Box
Size: As Per Gerber
Minimum Hole Diameter: 0.10 Mm
Min. Panel Size: 50mm X 50mm
Product Type: PCB Assembly
Bend Radius: 0.5-10mm
Send your inquiry directly to us