immersion gold pcb (198) Online Manufacturer
Min. Hole Size: 0.2mm
Thickness: 0.2mm-6.0mm
Special Requirements: Multiclass Impedance
Number Of Layers: 4-32 Layers
Min Line Width/Spacing: 0.1mm
Service: One-stop Service / OEM,DFM
Material: FR4, Polyimide, PET
Sanforized: Local High Density, Back Drill
Max Layer: 52L
Hole Position Deviation: ±0.05mm
Min Line Width/Spacing: 0.1mm
Service: One-stop Service / OEM,DFM
Layer Count: 2
Min Hole Size: 0.2MM
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Hole Position Deviation: ±0.05mm
Sanforized: Local High Density, Back Drill
Product Type: PCB Assembly
Bend Radius: 0.5-10mm
Bend Radius: 0.5-10mm
Product Type: PCB Assembly
Number Of Layers: 4-22 Layers
Copper Weight: 12OZ
Min Line Width/Spacing: 0.1mm
Solder Mask Colour: Black
Dielectric Constant: 2.55-10.2
Surface: Gold
Glass Epoxy: RO4350B 0.762mm
Silkscreen: White
Surface Finishing: HASL LF
No Of Layers: 4 Layer
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