electronic circuit board (373) Online Manufacturer
Thickness: 0.2mm
Minimum Hole Size: 0.2mm
Substrate Type: Rigid
Layers: 2
Substrate Type: Rigid
Minimum Hole Size: 0.2mm
Thickness: 0.2mm
Rohs Compliant: Yes
Profiling Punching: Routing, V-CUT, Beveling
Bend Radius: 0.5-10mm
Thickness: 0.2mm-6.0mm
Copper Weight: 12OZ
Feature: 100% E-test
Layers: Double
Raw Material: FR4 IT180
Impedance Control: Yes
Impedance Control: Yes
Hole Size: 0.1mm Laser Drill
Max Layer: 32L
Minimum Trace/Space: 0.05mm
Silkscreen Color: White, Black, Yellow
Surface: Gold
Thermal Conductivity: 170 W/mK
Solder Mask Colour: Black
Solder Mask Color: Green
Minimum Trace Width: 0.1mm
Function: 100% Pass Electrical Test
Solder Mask: Green, Black, Blue, Yellow, Red Etc.
Copper Weight: 12OZ
Surface Mount Technology: Yes
Size: /
Max. Panel Size: 600mm*1200mm
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