Pcb Name: Immersion Gold Ceramic PCB Board
Surface Finished: Immersion Gold,nickel-palladium GLOD
Thermal Conductivity: 170 W/mK
Dielectric Constant: 6.0-10.0
Surface Finished: Immersion Gold,nickel-palladium GLOD
Material: Al2O3,ALN
Layers: 1-8 Layers
Thermal Conductivity: 170 W/mK
Thermal Conductivity: 170 W/mK
Min Line Width/Spacing: 0.1mm
Min Line Width/Spacing: 0.1mm
Solder Mask Colour: Black
Product Type: PCB&PCBAOEM,DFM
Dielectric Constant: 6.0-10.0
Size: 2mm~200mm
Min Line Width/Spacing: 0.1mm
Pcb Size: 22mm*19mm
Layers: 1-8 Layers
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Material: FR4, Polyimide, PET
Pcb Layer: 1-28layers
Surface Finishing: HASL LF
Dimension: 41.55*131mm
Profiling Punching: Routing, V-CUT, Beveling
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Material: FR4, Polyimide, PET
Flexibility: 1-8 Times
Sanforized: Local High Density, Back Drill
Profiling Punching: Routing, V-CUT, Beveling
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