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LT CIRCUIT CO.,LTD. Products online

DFM Multilayer Ceramic PCB With Immersion Gold Technology Enig Finish Temp Resistant

Pcb Name: Immersion Gold Ceramic PCB Board

Surface Finished: Immersion Gold,nickel-palladium GLOD

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Advanced Ceramic Printed Circuit Board Immersion Gold Surface Finish Al2O3

Thermal Conductivity: 170 W/mK

Dielectric Constant: 6.0-10.0

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Durable Size 2mm~200mm Ceramic PCB Board AL2O3 ALN Black Solder Mask

Surface Finished: Immersion Gold,nickel-palladium GLOD

Material: Al2O3,ALN

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22mm*19mm Black Ceramic PCB Board With Thermal Conductivity Al2O3/ALN

Layers: 1-8 Layers

Thermal Conductivity: 170 W/mK

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Immersive Ceramic Substrate PCB With Thermal Conductivity 0.1mm Min Line 1-8 Layers

Thermal Conductivity: 170 W/mK

Min Line Width/Spacing: 0.1mm

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Al2O3/ALN Electronics Ceramic PCB Board 0.1mm Min Line Black Solder Mask

Min Line Width/Spacing: 0.1mm

Solder Mask Colour: Black

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Advanced Thermal Conductivity Ceramic PCB Board Immersion Gold

Product Type: PCB&PCBAOEM,DFM

Dielectric Constant: 6.0-10.0

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OEM 1-8 Layer PCB Board With Copper Clad Laminate Immersion Gold PCB

Size: 2mm~200mm

Min Line Width/Spacing: 0.1mm

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1-8Layer Immersion Gold Ceramic PCB Board Al2O3/ALN Dielectric Constant

Pcb Size: 22mm*19mm

Layers: 1-8 Layers

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High Durability Bendable PCB Rigid Flex Board With Local Density 1-28 Layers

Sanforized: Local High Density, Back Drill

Pcb Layer: 1-28layers

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Density Sanforized Rigid Flex PCB Assembly 1-28 Layers 52L 0.5-10mm Bend Radius

Sanforized: Local High Density, Back Drill

Pcb Layer: 1-28layers

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FR4/Polyimide/PET White Solder Mask FPC Circuit Board Bendable Circuit Board OEM

Material: FR4, Polyimide, PET

Pcb Layer: 1-28layers

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Sturdy Quick Turn Rigid Flex PCB With ENIG Surface Finish Professional Routing

Surface Finishing: HASL LF

Dimension: 41.55*131mm

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10 Layers Flexible Rigid PCB Assembly With V CUT Routing Immersion Gold Treatment

Profiling Punching: Routing, V-CUT, Beveling

Treatment: ENIG/OSP/Immersion Gold/Tin/Silver

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Four Layer Rigid Flexible Printed Circuit Board SMD BGA DIP Components 1-8 Flexibility

Material: FR4, Polyimide, PET

Flexibility: 1-8 Times

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Polyimide FR4 Density 28-Layer Rigid Flex Circuit Board With SMD Components

Sanforized: Local High Density, Back Drill

Profiling Punching: Routing, V-CUT, Beveling

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