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High Density Interconnector Model Board for 1.6mm Pcb Thickness 100%E-Testing

Min Trace: 3/3Mil

Pcb Thickness: 1.6mm

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Six Layers RO4835+4350 Rogers PCB Board High Frequency PCB Customized

Glass Epoxy: RO4730G3 0.762mm

Dielectric Constant: 2.55-10.2

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Gold Surface CLTE XT Rogers PCB Board White Silkscreen Diverse Finishes

Dielectric Constant: 2.55-10.2

Surface: Gold

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High Speed TU-933 FR-4 Glass Epoxy DK 3.6 Multilayer PCB Board 4-22 Layers

Thickness: 0.2mm-6.0mm

Copper Weight: 12OZ

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OEM Service Multilayer PCB Board Rogers PCBs RO4003C+FR-4 Tg170 16Layers

Size: /

Thickness: 0.2mm-6.0mm

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RO4003C Tg170 FR-4 Multilayer PCB Board Rogers PCB Board 12OZ Copper Weight

Packing: Vacuum Packing With Carton Box

Copper Weight: 12OZ

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SMT THT DIP Assembly Process HDI PCB Board with HASL Surface Finish and 0.5oz-6oz Copper Thickness

Thickness: 1.6mm, ±10%

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

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SMT THT DIP Assembly HDI PCB Board with Mini Holes 0.1mm and High Density Interconnector

Key Words: High Density Interconnector

Feature: Immersion Silver

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±10% Thickness White Silkscreen HDI PCB Board for Density Interconnect Applications

Mini Holes: 0.1mm

Min. Solder Mask Bridge: 0.075mm

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100%E-Testing Glass Epoxy PCB Board with Blind And Buried Vias and Immersion Surface

Blind And Buried Vias: Available

Thickness: 0.4-3.2mm

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Advanced SMT THT DIP SMT PCB Assembly with HDI PCB Board and Min. Solder Mask Bridge 0.075mm

Copper Thickness: 0.5oz-6oz

Pcb Assembly Process: SMT THT DIP SMT PCB Assembly

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Gold Finished 12 Layer PCB Board Black High Density Interconnect PCB With BGA

Packing: Vacuum Packing With Carton Box

Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP

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Surface Mount Technology Compatible HDI PCB Board with White Silkscreen and 1.6mm Thickness

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.

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Electronics Industry Multilayer PCB Board With Immersion Gold Surface

Copper Thickness: 0.5oz-6oz

Number Of Layers: 4-22 Layers

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High Copper Weight Multilayer Pcbs 4-22 Layers Tg170 FR-4 Glass Epoxy 12OZ

Min. Hole Size: 0.2mm

Thickness: 0.2mm-6.0mm

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Turnaround Any Layer HDI PCB With Minimum 3mil Line HASL / ENIG Surface Finish ROGERS+FR4

Min. Finished Hole Size: 0.1mm

Minimum Line Width/Spacing: 3mil/3mil

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7 Layers Rogers PCBs Board With ENIG 3U" Any Layers RO4350B 0.5OZ High Frequency

ENIG IP4452 Surface Finish 7 Layer PCB Pure Rogers Anylayer PCB

Rogers Multilayer PCB Board Quick Turn From 24 Hour Customized 0.2mm-6.0mm

High Speed SMT THT DIP SMT PCB Assembly Process with High Density Interconnector Glass Epoxy Rogers Corp. PCB Board

High Density Interconnector Model Board for 1.6mm Pcb Thickness 100%E-Testing

Six Layers RO4835+4350 Rogers PCB Board High Frequency PCB Customized

Gold Surface CLTE XT Rogers PCB Board White Silkscreen Diverse Finishes

High Speed TU-933 FR-4 Glass Epoxy DK 3.6 Multilayer PCB Board 4-22 Layers

OEM Service Multilayer PCB Board Rogers PCBs RO4003C+FR-4 Tg170 16Layers

RO4003C Tg170 FR-4 Multilayer PCB Board Rogers PCB Board 12OZ Copper Weight

SMT THT DIP Assembly Process HDI PCB Board with HASL Surface Finish and 0.5oz-6oz Copper Thickness

SMT THT DIP Assembly HDI PCB Board with Mini Holes 0.1mm and High Density Interconnector

±10% Thickness White Silkscreen HDI PCB Board for Density Interconnect Applications

100%E-Testing Glass Epoxy PCB Board with Blind And Buried Vias and Immersion Surface

Advanced SMT THT DIP SMT PCB Assembly with HDI PCB Board and Min. Solder Mask Bridge 0.075mm

Gold Finished 12 Layer PCB Board Black High Density Interconnect PCB With BGA

Surface Mount Technology Compatible HDI PCB Board with White Silkscreen and 1.6mm Thickness

Electronics Industry Multilayer PCB Board With Immersion Gold Surface

High Copper Weight Multilayer Pcbs 4-22 Layers Tg170 FR-4 Glass Epoxy 12OZ

Turnaround Any Layer HDI PCB With Minimum 3mil Line HASL / ENIG Surface Finish ROGERS+FR4