hdi printed circuit board (88) Online Manufacturer
Surface Mount Technology: Available
Vip Process: Yes
Board Layer: 6-32L
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Key Words: High Density Interconnector
Layer Count: 4-20 Layers
Impedance Control: Yes
Aspect Ratio: 10:1
Packing: Vacuum Packing With Carton Box
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Minimum Hole Size: 0.1mm
Lead Time: 2-5 Days
Copper Weight: 0.5oz-6oz
Silkscreen Color: White, Black, Yellow
Min. Finished Hole Size: 0.1mm
Minimum Line Width/Spacing: 3mil/3mil
Min. Annular Ring: 3mil
Material: FR-4
Minimum Line Width/Spacing: 3mil/3mil
Surface Finish: HASL, ENIG, Immersion Silver, OSP
Min. Annular Ring: 3mil
Min. Finished Hole Size: 0.1mm
Components: SMD, BGA, DIP, Etc.
Surface Finishing: HASL LF
Special Request: Half Hole, 0.25mm BGA
Impedance Control: Yes
Min. Annular Ring: 3mil
Layer Count: Any Layer
Impedance Control: Yes
Board Layer: 6-32L
Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Send your inquiry directly to us