hdi printed circuit board (88) Online Manufacturer
Key Words: High Density Interconnector
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Raw Material: FR4 IT180
Impedance Control: Yes
Key Words: High Density Interconnector
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Testing: 100%E-Testing,X-RAY
Thickness: 0.4-3.2mm
Copper Thickness: 0.5oz-6oz
Key Words: High Density Interconnector
Hole Size: 0.1mm Laser Drill
Special Requirements: Lamp Socket
Inner Layer Spacing: 0.15mm
Thickness: 0.4-3.2mm
Blind Vias: Yes
Key Words: High Density Interconnector
Impedance Control: +/-10%
Bga: 10MIL
Special Request: Half Hole, 0.25mm BGA
Min Trace: 3/3Mil
Mini Holes: 0.1mm
Min. Solder Mask Bridge: 0.075mm
Copper Thickness: 0.5oz-6oz
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Board Layer: 6-32L
Testing: 100%E-Testing,X-RAY
Impedance Control: +/-10%
Misalignment Of Layers: +/- 0.06
Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.
Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.
Min Trace: 3/3Mil
Board Layer: 6-32L
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