hdi printed circuit board (88) Online Manufacturer
Raw Material: FR4 IT180
Layer Count: 4-20 Layers
Special Request: Half Hole, 0.25mm BGA
Aspect Ratio: 10:1
Board Layer: 6-32L
Aspect Ratio: 10:1
Raw Material: FR4 IT180
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Impedance Control: Yes
Testing: 100%E-Testing,X-RAY
Smallest Hole Size: 0.1mm
Min Via: 0.1mm
Lead Time: 2-5 Days
Min. Annular Ring: 3mil
Aspect Ratio: 10:1
Impedance Control: Yes
Key Words: High Density Interconnector
Testing: 100%E-Testing,X-RAY
Min. Bga Pitch: 0.3mm
Impedance Control: +/-10%
Lead Time: 2-5 Days
Thickness: 0.2mm-6.0mm
Layers: 1 Layer
Material: AL3003
Material: FR4, Polyimide, PET
Flexibility: 1-8 Times
Layers: 2
Material: TG170
Raw Material: FR4 IT180
Layer Count: 4-20 Layers
Pcb Layer: 1-28layers
No Of Layers: 4 Layer
Send your inquiry directly to us