Density Interconnect PCBs with Impedance Control HASL/ENIG Immersion Silver 3mil Minimum Line White/Black/Yellow
The HDI Any Layer PCBs represent a pinnacle of technological advancement in the realm of printed circuit board (PCB) design and manufacturing. These PCBs are specifically created to meet the increasing demands for miniature interconnect systems that can handle complex and high-density assemblies. With a focus on performance, reliability, and versatility, the HDI Any Layer PCBs are engineered to support the most demanding electronic applications.
At the core of the HDI Any Layer PCBs is the High Density Interconnect Any Layer technology, which allows for the placement of any layer directly on top of another with no restriction in the sequence. This provides unparalleled flexibility in circuit design and significantly enhances the electrical performance of the final product. The use of any-layer interconnects minimizes the need for multiple signal layers, thereby reducing the PCB size and overall material usage, which is critical in today's drive towards miniaturization.
These PCBs come with a range of copper weights, starting from a lightweight 0.5oz to a robust 6oz. This variety ensures that whether your application requires delicate, precise signal transmission or needs to handle high current loads, there's a suitable option available. The ability to choose the appropriate copper weight allows designers to carefully balance the PCB's thermal characteristics with the electrical requirements of the system.
When it comes to precision and ensuring the reliability of connections, the HDI Any Layer PCBs boast a minimum annular ring of just 3mil. This fine level of detail is crucial for high-density assembly systems, where every fraction of a millimeter counts in preventing short circuits and maintaining the integrity of the electrical pathways. With such precision, these PCBs are capable of supporting extremely fine-pitched components, which is a necessity in modern, compact electronic devices.
The thickness of the PCB can vary significantly, from a slim 0.2mm to a sturdy 6.0mm, thereby accommodating a diverse array of product needs. Whether the application demands a flexible, slim board for a wearable device or a thick, durable PCB for a high-power application, the HDI Any Layer PCBs can be tailored to meet these requirements without compromising on quality or performance.
Ensuring that every PCB is free from defects is crucial, which is why the HDI Any Layer PCBs undergo rigorous testing procedures, including the Flying Probe Test and E-test. These testing methodologies are integral to confirming the functionality and reliability of each PCB before they leave the manufacturing facility. By employing such advanced testing techniques, the HDI Any Layer PCBs provide the assurance that they will perform as intended in their final applications.
In terms of conductive trace creation, these PCBs are capable of supporting a minimum line width and spacing of just 3mil/3mil. This exceptional resolution enables the design of highly complex circuits within a condensed area, which is a key attribute of any high-density assembly system. The fine line and spacing capabilities also allow for more efficient signal routing, reduced cross-talk, and improved overall electrical performance, which are essential characteristics in the development of high-speed digital and RF circuits.
In summary, the HDI Any Layer PCBs are a superior choice when it comes to high-density interconnect solutions. They are meticulously designed to incorporate a miniature interconnect system that is both versatile and robust. With features like a wide range of copper weights, ultra-fine annular rings, varying thickness options, and precision line width and spacing, these PCBs are tailored to push the boundaries of what's possible in modern electronics. Whether for consumer electronics, medical devices, or aerospace applications, the HDI Any Layer PCBs offer the reliability and performance necessary to drive innovation and meet the ever-increasing complexity of electronic systems.
| Technical Parameter | Specification |
|---|---|
| Thickness | 0.2mm-6.0mm |
| Lead Time | 2-5 Days |
| Silkscreen Color | White, Black, Yellow |
| Layer Count | Any Layer |
| Minimum Line Width/Spacing | 3mil/3mil |
| Minimum Hole Size | 0.1mm |
| Material | FR-4 |
| Copper Weight | 0.5oz-6oz |
| Solder Mask Color | Green, Red, Blue, Black, Yellow, White |
| Impedance Control | Yes |
High-Density Interconnect (HDI) Any Layer PCBs are at the forefront of modern printed circuit board (PCB) technologies due to their capability to support complex and high-density component layouts. These boards are used in various applications and scenarios where space constraints and electrical performance are critical. The HDI Any Layer PCBs come with multiple options for solder mask colors, including green, red, blue, black, yellow, and white, allowing for customization and easy identification during assembly and testing processes.
With a minimum hole size of 0.1mm, HDI Any Layer PCBs are ideal for applications requiring high-precision interconnections, such as in High-Density Integrated Circuit (HDIC) Interconnection Boards. This feature enables the incorporation of finer pitch components and a higher count of I/O in smaller geometries, which is essential for advanced microelectronics found in smartphones, tablets, and other portable devices.
The thickness range of 0.2mm to 6.0mm offers versatility for different product requirements, from ultra-thin portable devices to more robust computing and industrial equipment. The minimum annular ring specification of 3mil supports the reliability of vias in HDI designs, ensuring stable connections between layers under thermal and mechanical stresses.
Surface finishes available for the HDI Any Layer PCBs include Hot Air Solder Leveling (HASL), Electroless Nickel Immersion Gold (ENIG), Immersion Silver, and Organic Solderability Preservatives (OSP). These finishes not only protect the copper surfaces from oxidation but also ensure a reliable solderable surface during component assembly. This versatility is essential in high-density wiring boards where signal integrity and long-term reliability are paramount.
The application of HDI Any Layer PCBs spans across various industries including aerospace, medical, automotive, and consumer electronics, where High-Density Wiring Boards are crucial for the miniaturization of products without compromising performance. In medical devices such as pacemakers, the compact and high-precision nature of HDI PCBs allows for the integration of more functionality into smaller packages, enhancing patient comfort and device performance.
In summary, HDI Any Layer PCBs are a key component in modern electronic design, offering high-density interconnections, robust performance, and versatility in applications ranging from portable consumer devices to critical aerospace and medical technologies. The combination of small feature sizes, a variety of solder mask colors, and multiple surface finish options makes these PCBs an essential choice for engineers and designers seeking to push the boundaries of electronic device miniaturization and complexity.
Our HDI Any Layer PCBs offer advanced Product Customization Services to meet the requirements of sophisticated designs. With Impedance Control, we ensure signal integrity for your Multilayer High-Density Printed Circuit Board applications. Our technology allows for a Minimum Hole Size as small as 0.1mm, enabling High-Density Wiring Board designs that accommodate more components in a compact area.
We use high-quality FR-4 Material for robustness and reliability, suitable for a wide range of High-Density Integrated Circuit Interconnection Board applications. Our thorough Testing process includes both Flying Probe Test and E-test to ensure that each PCB meets our stringent quality standards.
To cater to the demands of modern electronics, we offer fine-line technology with a Minimum Line Width/Spacing of 3mil/3mil, pushing the boundaries of what's possible in PCB design and allowing for greater circuit complexity and increased functionality.
Our HDI Any Layer PCBs are designed with the latest in high-density interconnect technology, ensuring superior electrical performance and reliability for our customers. We provide comprehensive technical support and services to ensure your complete satisfaction with our products.
Our technical support includes detailed product documentation, which covers specifications, handling instructions, and best practices for design and assembly. Additionally, we provide FAQs and troubleshooting guides to help you resolve common issues quickly and efficiently.
We offer professional design services to assist you in optimizing your PCB layout for HDI applications. Our team of experienced engineers can provide guidance on stack-up design, via placement, and material selection to maximize the performance of your HDI Any Layer PCBs.
To ensure the longevity and performance of your PCBs, we provide comprehensive testing services, including electrical testing, impedance control testing, and thermal analysis. We work closely with you to define test parameters that meet your specific requirements.
For any technical inquiries or assistance, our customer service team is available to provide prompt and knowledgeable support. We are committed to providing you with the resources and help you need to make the most of your HDI Any Layer PCBs.
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