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White/Black/Yellow Silkscreen HDI PCBs Impedance Control FR-4 3mil Min. Annular Ring

White/Black/Yellow Silkscreen HDI PCBs Impedance Control FR-4 3mil Min. Annular Ring

Yellow Silkscreen HDI PCBs

White Silkscreen HDI PCBs

White Silkscreen anylayer pcb

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Product Details
Copper Weight:
0.5oz-6oz
Silkscreen Color:
White, Black, Yellow
Material:
FR-4
Min. Annular Ring:
3mil
Lead Time:
2-5 Days
Testing:
Flying Probe Test, E-test
Thickness:
0.2mm-6.0mm
Impedance Control:
Yes
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Product Description

White/Black/Yellow Silkscreen HDI PCBs Impedance Control FR-4 3mil Min. Annular Ring

Product Description:

The HDI Any Layer PCBs represent the pinnacle of printed circuit board engineering, incorporating cutting-edge technology to facilitate complex and high-performance electronic applications. These boards are characterized by an any-layer interconnect structure, which allows for a more flexible design by enabling conductive connections between any layers of the PCB. This design is essential in today's compact and high-speed electronic devices, where space optimization and signal integrity are paramount.

Our High-Density Interconnect Board (HDI Board) features an impressive layer count flexibility, aptly described as "Any Layer." This means that our manufacturing process is capable of handling PCBs with various layers, tailored to meet the specific requirements of your complex electronic circuits. Whether you're in need of a simple four-layer board or a sophisticated ten-layer design, our HDI Any Layer PCBs can be customized to fit your needs.

One of the most striking features of the HDI Any Layer PCBs is the minimal annular ring size of 3mil (0.0762mm). This ultra-fine feature allows for more pads to be placed on the board, significantly increasing the density of the component placement. By reducing the size of the annular rings, designers can capitalize on the space saved to pack more functionality into a smaller area, making these PCBs ideal for modern, miniaturized electronic devices.

The base material used in the production of our HDI Any Layer PCBs is the industry standard FR-4. Known for its excellent electrical insulation and thermal resistance, FR-4 is a composite material that ensures durability and reliability for a wide range of electronic applications. Its widespread use and acceptance in the industry make it the ideal material choice for both prototyping and mass production of high-density interconnect any-layer PCBs.

In terms of precision, our HDI Any Layer PCBs boast a minimum hole size of 0.1mm, which supports the inclusion of fine-pitch components and enables high-density component placement. This feature is particularly crucial for applications requiring a large number of interconnects within a confined space. With such precision, these PCBs can support advanced technologies, including micro vias and buried vias, which are fundamental to enhancing the performance of high-speed circuits.

Our production lead time for these High-Density Interconnect Any Layer PCBs is remarkably swift, ranging from 2 to 5 days. This quick turnaround time ensures that your project keeps moving forward without unnecessary delays, helping you meet tight deadlines and bring your products to market faster. We understand the importance of time-to-market in the competitive electronics industry, and we strive to provide the fastest possible service without compromising the quality of our PCBs.

In conclusion, the HDI Any Layer PCBs are a perfect solution for those seeking high-density, high-reliability, and high-performance printed circuit boards. With flexible layer counts, minimal annular ring sizes, durable FR-4 material, and precision drilling capabilities, these PCBs stand at the forefront of PCB technology. Whether you are developing sophisticated consumer electronics, intricate medical devices, or critical aerospace components, our HDI Any Layer PCBs are designed to meet the rigorous demands of your applications, ensuring that your product performs at its best in any scenario.

 

Features:

  • Product Name: HDI Any Layer PCBs
  • Lead Time: 2-5 Days
  • Layer Count: Any Layer
  • Solder Mask Color: Green, Red, Blue, Black, Yellow, White
  • Min. Finished Hole Size: 0.1mm
  • Thickness: 0.2mm-6.0mm
  • Feature: Multilayer Interconnect System
  • Feature: Multilayer High-Density Printed Circuit Board
  • Feature: Any-Layer Interconnect Board
 

Technical Parameters:

Technical Parameter Specification
Minimum Hole Size 0.1mm
Minimum Line Width/Spacing 3mil/3mil
Testing Flying Probe Test, E-test
Material FR-4
Thickness 0.2mm-6.0mm
Copper Weight 0.5oz-6oz
Surface Finish HASL, ENIG, Immersion Silver, OSP
Lead Time 2-5 Days
Impedance Control Yes
Min. Annular Ring 3mil
 

Applications:

The HDI (High-Density Interconnect) Any Layer PCBs are at the forefront of modern printed circuit board technology, offering unparalleled flexibility and performance for a multitude of applications. With their ability to have any layer interconnected, they are an ideal choice for scenarios where space is at a premium, and high-density wiring boards are essential.

These PCBs boast a minimum line width and spacing of 3mil/3mil, making them suitable for high-precision requirements in advanced electronic devices. The minuscule finished hole size of 0.1mm further ensures that even the most intricate components can be accommodated, making these boards perfect for applications in the medical, aerospace, and telecommunication industries, where reliability and accuracy are of utmost importance.

With a quick lead time of 2-5 days, the HDI Any Layer PCBs are excellent for rapid prototyping and urgent projects. Electronics manufacturers can benefit from the swift turnaround time to stay ahead in a competitive market, especially when developing cutting-edge products that require rapid iteration and testing.

The any-layer interconnect board is versatile when it comes to design aesthetics as well, offering silkscreen colors in white, black, and yellow to match or contrast with the rest of the device. This feature is particularly useful for consumer electronics, where branding and visual design are key to product differentiation.

Furthermore, these PCBs are used in complex devices such as smartphones, tablets, and laptops, where the high-density wiring board allows for more functions in a smaller space. The technology is also increasingly important in the Internet of Things (IoT) devices, where interconnectivity and miniaturization are pivotal. Additionally, military and automotive industries employ these PCBs for their robustness and ability to withstand harsh environments.

In summary, the HDI Any Layer PCBs are ideal for any application that demands high-density wiring, exceptional performance, and reliability. Whether for rapid prototyping or mass production, their advanced features provide an excellent foundation for the development and deployment of sophisticated electronic devices across various industries.

 

Customization:

Our High-Density Integrated Circuit Interconnection Board (HDI) offers advanced features for a new era of electronic devices. The High Density Interconnect Any Layer (HDI Any Layer) PCBs are customizable to meet the needs of complex and compact designs.

With a minimum hole size of 0.1mm, our Any-Layer Interconnect Board provides precise and reliable interconnections for high-density component placement. Impedance control is a standard feature, ensuring signal integrity for all your high-speed applications.

Customize the look and functionality of your HDI Any Layer PCBs with our variety of solder mask colors. Choose from Green, Red, Blue, Black, Yellow, or White to match your project's unique aesthetics or coding requirements.

The Min. Finished Hole Size remains impressive at 0.1mm, allowing for the placement of fine-pitch components and ensuring excellent electrical performance.

To enhance the durability and performance of your circuit boards, select from our range of surface finishes: HASL for a cost-effective option, ENIG for excellent surface planarity, Immersion Silver for good solderability, or OSP for a lead-free solution.

 

Support and Services:

Our HDI (High-Density Interconnect) Any Layer PCBs are designed for high-performance and reliability, catering to the needs of advanced electronic applications. To ensure you get the most out of our products, we offer comprehensive technical support and services which include:

Product Consultation – Our team of experts can provide guidance on selecting the right HDI Any Layer PCB configurations for your specific needs, ensuring optimal performance and compatibility with your electronic components.

Design Support – We offer support during the design phase, including feedback on layout, stack-up, materials, and trace optimization to meet your application's requirements.

Manufacturing Support – We can assist with manufacturing queries, from understanding our process capabilities to ensuring your design is manufacturable with high yield and quality.

Testing and Quality Assurance – Our products undergo rigorous testing and quality control procedures. We can provide assistance in interpreting test results and implementing any necessary changes for quality improvement.

Troubleshooting – Should you encounter any issues with our HDI Any Layer PCBs, our technical support team is ready to help with troubleshooting and problem resolution to minimize any potential downtime.

After-Sales Service – We are committed to customer satisfaction, offering after-sales support to address any concerns or questions that may arise after your purchase.

Documentation and Resources – Access to a wide range of documentation and resources is available to support the use and integration of our HDI Any Layer PCBs into your projects.

Our technical support and services are designed to provide you with seamless assistance throughout the lifecycle of your HDI Any Layer PCBs, ensuring that your projects are successful and your products perform to the highest standards.

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