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6-32 Layer HDI PCB Manufacturing With 0.25mm BGA And Half Hole For Lamp Socket 20 Layers Tuc TU-933 High Speed PCB

Aspect Ratio: 10:1

Key Words: High Density Interconnector

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0.2mm-6.0mm Thickness Any Layer HDI PCB HASL/ENIG Immersion Silver

Minimum Line Width/Spacing: 3mil/3mil

Surface Finish: HASL, ENIG, Immersion Silver, OSP

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Turnaround Any Layer HDI PCB With Minimum 3mil Line HASL / ENIG Surface Finish ROGERS+FR4

Min. Finished Hole Size: 0.1mm

Minimum Line Width/Spacing: 3mil/3mil

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Customization Advanced Any Layer HDI PCB With Copper Weight 0.5oz-6oz

Min. Annular Ring: 3mil

Min. Finished Hole Size: 0.1mm

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Shengyi S1000 TG170 Any Layer HDI PCB 1.6MM Board Thickness 7 Layers

Layers: 7 Layers

Material: Shengyi S1000 TG170

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Advanced Any Layer HDI PCB FR-4 With Impedance Control Flying Probe Test

Min. Annular Ring: 3mil

Material: FR-4

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FR4 IT180 HDI PCB Board 4-20 Layer With Lamp Socket 3/3Mil Trace

Pcb Name: 4L 1+N+1 HDI Boards

Layer Count: 4-20 Layers

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4 Layer 1 OZ Copper HDI PCB Board with 0.1MM Min Hole Size for Lamp Socket

Pcb Name: 4L 1+N+1 HDI Boards

Minimum Hole Size: 0.15mm

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6-32L Board Layer HDI PCB Board Made of FR4 IT180 Raw Material and 0.1mm Laser Drill Hole Size for Applications

Key Words: High Density Interconnector

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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FR4 IT180 4-20 Layers HDI PCB Board with Multi Impedance Control and 0.1mm Hole Nickel-Palladium BGA 0.2mm

Impedance Control: Yes

Aspect Ratio: 10:1

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0.15mm Inner Layer Spacing HDI PCB Board with White Silk and Smallest Hole Size 0.1mm Benefit

Inner Layer Spacing: 0.15mm

Thickness: 0.4-3.2mm

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12 Layers HDI 2+N+2 Stacked holes PCBs

Layers: 12 Layers

Material: Shengyi S1000 TG170

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14 Layers HDI 2+N+2 laser holes PCBs

Layers: 14 Layers

Material: ITEQ IT180

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4Layer HDI PCB Board With Impedance Control Density Interconnector X Ray Testing

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

Pcb Name: 4L 1+N+1 HDI Boards

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Impedance Controlled FR-4 HDI PCBs White/Black/Yellow Silkscreen 3mil Line

Minimum Hole Size: 0.1mm

Lead Time: 2-5 Days

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High Density HDI PCB Board With Half Hole BGA 0.25mm Lamp Socket 10 1 Aspect Ratio

Special Request: Half Hole, 0.25mm BGA

Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)

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6-32 Layer HDI PCB Manufacturing With 0.25mm BGA And Half Hole For Lamp Socket 20 Layers Tuc TU-933 High Speed PCB

0.2mm-6.0mm Thickness Any Layer HDI PCB HASL/ENIG Immersion Silver

Turnaround Any Layer HDI PCB With Minimum 3mil Line HASL / ENIG Surface Finish ROGERS+FR4

Customization Advanced Any Layer HDI PCB With Copper Weight 0.5oz-6oz

6-32 Layer HDI PCB Manufacturing With 0.25mm BGA And Half Hole For Lamp Socket 20 Layers Tuc TU-933 High Speed PCB

0.2mm-6.0mm Thickness Any Layer HDI PCB HASL/ENIG Immersion Silver

Turnaround Any Layer HDI PCB With Minimum 3mil Line HASL / ENIG Surface Finish ROGERS+FR4

Customization Advanced Any Layer HDI PCB With Copper Weight 0.5oz-6oz

Shengyi S1000 TG170 Any Layer HDI PCB 1.6MM Board Thickness 7 Layers

Advanced Any Layer HDI PCB FR-4 With Impedance Control Flying Probe Test

FR4 IT180 HDI PCB Board 4-20 Layer With Lamp Socket 3/3Mil Trace

4 Layer 1 OZ Copper HDI PCB Board with 0.1MM Min Hole Size for Lamp Socket

6-32L Board Layer HDI PCB Board Made of FR4 IT180 Raw Material and 0.1mm Laser Drill Hole Size for Applications

FR4 IT180 4-20 Layers HDI PCB Board with Multi Impedance Control and 0.1mm Hole Nickel-Palladium BGA 0.2mm

0.15mm Inner Layer Spacing HDI PCB Board with White Silk and Smallest Hole Size 0.1mm Benefit

12 Layers HDI 2+N+2 Stacked holes PCBs

14 Layers HDI 2+N+2 laser holes PCBs

4Layer HDI PCB Board With Impedance Control Density Interconnector X Ray Testing

Impedance Controlled FR-4 HDI PCBs White/Black/Yellow Silkscreen 3mil Line

High Density HDI PCB Board With Half Hole BGA 0.25mm Lamp Socket 10 1 Aspect Ratio