high density interconnect pcb (174) Online Manufacturer
Feature: 100% E-test
Layers: Double
Aspect Ratio: 10:1
Minimum Hole Size: 0.15mm
Bend Radius: 0.5-10mm
Components: SMD, BGA, DIP, Etc.
Material: FR4, Polyimide, PET
Sanforized: Local High Density, Back Drill
Max Layer: 52L
No Of Layers: 4 Layer
Lead Time: 2-5 Days
Min. Annular Ring: 3mil
Raw Material: FR4 IT180
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Silkscreen: White, Black, Yellow, Etc.
Pcb Assembly Process: SMT THT DIP SMT PCB Assembly
Raw Material: FR4 IT180
Layer Count: 4-20 Layers
Number Of Layers: 4-22 Layers
Packing: Vacuum Packing With Carton Box
Pcb Standard: IPC-A-610 D
Lead Time: 5-7 Working Days
Max Layer: 52L
Pcb Layer: 1-28layers
Surface Mount Technology: Yes
Packing: Vacuum Packing With Carton Box
Number Of Layers: 2
Copper: 1oz
Conductor Space: 5 Mil
Copper: 1oz
Board Layer: 6-32L
Aspect Ratio: 10:1
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