electronic circuit board (336) Online Manufacturer
Min. Bga Pitch: 0.3mm
Impedance Control: +/-10%
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Special Requirements: Multiclass Impedance
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Thickness: 0.2mm-6.0mm
Layers: 1 Layer
Material: AL3003
Pcb Name: 4L 1+N+1 HDI Boards
Raw Material: FR4 IT180
Pcb Size: 22mm*19mm
Layers: 1-8 Layers
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Pcb Name: 4L 1+N+1 HDI Boards
Pcb Name: 4L 1+N+1 HDI Boards
Minimum Hole Size: 0.15mm
Pcb Name: 4L 1+N+1 HDI Boards
Layer Count: 4-20 Layers
Thickness: 0.2mm-6.0mm
Copper Thickness: 0.5oz-6oz
Surface Technics: ENIG,nickel-palladium GLOD
Thermal Conductivity: 170 W/mK
Raw Material: FR4 IT180
Pcb Name: 4L 1+N+1 HDI Boards
Key Words: High Density Interconnector
Special Requirements: Lamp Socket
Min. Hole Size: 0.2mm
Thickness: 0.2mm-6.0mm
Copper Thickness: 0.5oz-6oz
Number Of Layers: 4-22 Layers
Function: 100% Pass Electrical Test
Pcbthickness: 1.6mm
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