electronic circuit board (258) Online Manufacturer
Layers: 2
Material: TG170
Pcb Layer: 1-28layers
Product Type: PCB Assembly
Max Layer: 52L
No Of Layers: 4 Layer
Material: FR4, Polyimide, PET
Sanforized: Local High Density, Back Drill
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Surface Finishing: HASL LF
Min. Hole Size: 0.2mm
Lead Time: 5-7 Days
Surface Finish: ENIG
Minimum Hole Size: 0.2mm
Copper Weight: 12OZ
Packing: Vacuum Packing With Carton Box
Thickness: 0.2mm-6.0mm
Surface Mount Technology: Yes
Sanforized: Local High Density, Back Drill
Profiling Punching: Routing, V-CUT, Beveling
Material: FR4, Polyimide, PET
Pcb Layer: 1-28layers
Min Line Width/Spacing: 0.1mm
Surface Technics: ENIG,nickel-palladium GLOD
Pcb Layer: 1-28layers
No Of Layers: 4 Layer
Surface Mount Technology: Yes
Packing: Vacuum Packing With Carton Box
Material: FR4, Polyimide, PET
Flexibility: 1-8 Times
video
Aspect Ratio: 10:1
Minimum Hole Size: 0.15mm
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