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Rogers Multilayer PCB Board Quick Turn From 24 Hour Customized 0.2mm-6.0mm

Thickness: 0.2mm-6.0mm

Copper Thickness: 0.5oz-6oz

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RO4003C Tg170 FR-4 Multilayer PCB Board Rogers PCB Board 12OZ Copper Weight

Packing: Vacuum Packing With Carton Box

Copper Weight: 12OZ

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FR-4 Raw Material Double Layer PCB 1.6mm for Temperature and Voltage Environments

Silkscreen Color: White,Black,yellow

Min Hole Dia: 0.075 Mm

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1-6oz Copper Weight Green Solder Resist Shipping Double Sided PCB via DHL UPS EMS TNT FedEx

Raw Material: Fr - 4

Shipping: DHL UPS EMS TNT FedEx,Express Courier,Sea Transport

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4Layer Smd Components Flexrigid Pcb Bendable Circuit Board Hasl Lf Surface Finish

Pcb Layer: 1-28layers

No Of Layers: 4 Layer

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Smd Bga Dip Rigid Flex PCB Assembly 4 Layer Sanforized Hasl Lf Surface

Components: SMD, BGA, DIP, Etc.

Hole Position Deviation: ±0.05mm

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4 Layer Pcb Board Flexible Bendable Pcb With Sanforized Coating Hasl Lf Finish

Surface Finishing: HASL LF

No Of Layers: 4 Layer

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Enig Surface Finish Rigid Flex PCB Assembly Bendable With 1-8 Flexibility

Treatment: ENIG/OSP/Immersion Gold/Tin/Silver

Dimension: 41.55*131mm

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1-8Layer Immersion Gold Ceramic PCB Board Al2O3/ALN Dielectric Constant

Pcb Size: 22mm*19mm

Layers: 1-8 Layers

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Advanced Thermal Conductivity Ceramic PCB Board Immersion Gold

Product Type: PCB&PCBAOEM,DFM

Dielectric Constant: 6.0-10.0

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Immersive Ceramic Substrate PCB With Thermal Conductivity 0.1mm Min Line 1-8 Layers

Thermal Conductivity: 170 W/mK

Min Line Width/Spacing: 0.1mm

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DFM Multilayer Ceramic PCB With Immersion Gold Technology Enig Finish Temp Resistant

Pcb Name: Immersion Gold Ceramic PCB Board

Surface Finished: Immersion Gold,nickel-palladium GLOD

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OEM Precision Ceramic Multilayer PCB With 0.1mm Min Line Immersion Gold Surface

Layers: 1-8 Layers

Min Line Width/Spacing: 0.1mm

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Black Solder Mask Ceramic PCB Board Manufacturing One Stop Service

Thermal Conductivity: 170 W/mK

Solder Mask Colour: Black

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Customization Ceramic PCB Board Immersion Gold ENIG Coated One Stop Service

Surface Technics: ENIG,nickel-palladium GLOD

Thermal Conductivity: 170 W/mK

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