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Conductor Space: 3 Mil

Raw Material: FR-4

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Copper Weight: 1-6oz

Layers: Double

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Type: Insulation Sheet,PCB Base Board

Solder Mask Color: Clients Required

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Number Of Layers: Double-sided Printed Circuit Board

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Pcb Size: 22mm*19mm

Layers: 1-8 Layers

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Thermal Conductivity: 170 W/mK

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Key Words: High Density Interconnector

Feature: Immersion Silver

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Mini Holes: 0.1mm

Min. Solder Mask Bridge: 0.075mm

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Finished Copper Thickness: 1oz

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Final Foil External: 1.oz

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Copper Thickness: 0.5-6.0oz

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Min Line Width/Spacing: 0.1mm

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Packing: Vacuum Packing With Carton Box

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ShengYi S1000 Blue Solder PCB With Blind Holes For Smart Phone 8 Layer

Immersion Gold Double Sided PCB 100% E-test for Superior Performance

Customization Double Sided PCB Electronic Components With 3 Mil Conductor Space

Voltage IMS PCB Board 3KV Withstand Custom Surface Finish 0.6-6.0MM

0.075/0.075mm Min. Line Width/Spacing IMS PCB With And Custom Surface Finishing

1-8Layer Immersion Gold Ceramic PCB Board Al2O3/ALN Dielectric Constant

Black Solder Mask Ceramic PCB Board Manufacturing One Stop Service

SMT THT DIP Assembly HDI PCB Board with Mini Holes 0.1mm and High Density Interconnector

±10% Thickness White Silkscreen HDI PCB Board for Density Interconnect Applications

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1.6mm Thick Dual Sided PCB For Double Layers And Advanced Manufacturing

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Gold Finished 12 Layer PCB Board Black High Density Interconnect PCB With BGA

DFM Multilayer Ceramic PCB With Immersion Gold Technology Enig Finish Temp Resistant