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SMT THT DIP Assembly HDI PCB Board with Mini Holes 0.1mm and High Density Interconnector

Key Words: High Density Interconnector

Feature: Immersion Silver

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±10% Thickness White Silkscreen HDI PCB Board for Density Interconnect Applications

Mini Holes: 0.1mm

Min. Solder Mask Bridge: 0.075mm

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100%E-Testing Glass Epoxy PCB Board with Blind And Buried Vias and Immersion Surface

Blind And Buried Vias: Available

Thickness: 0.4-3.2mm

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Advanced SMT THT DIP SMT PCB Assembly with HDI PCB Board and Min. Solder Mask Bridge 0.075mm

Copper Thickness: 0.5oz-6oz

Pcb Assembly Process: SMT THT DIP SMT PCB Assembly

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Gold Finished 12 Layer PCB Board Black High Density Interconnect PCB With BGA

Packing: Vacuum Packing With Carton Box

Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP

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Surface Mount Technology Compatible HDI PCB Board with White Silkscreen and 1.6mm Thickness

Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp.

Surface Finish: HASL, ENIG, OSP, Immersion Silver, Immersion Tin, Etc.

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Electronics Industry Multilayer PCB Board With Immersion Gold Surface

Copper Thickness: 0.5oz-6oz

Number Of Layers: 4-22 Layers

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High Copper Weight Multilayer Pcbs 4-22 Layers Tg170 FR-4 Glass Epoxy 12OZ

Min. Hole Size: 0.2mm

Thickness: 0.2mm-6.0mm

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Turnaround Any Layer HDI PCB With Minimum 3mil Line HASL / ENIG Surface Finish ROGERS+FR4

Min. Finished Hole Size: 0.1mm

Minimum Line Width/Spacing: 3mil/3mil

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Panasonic M6 M8 FR-4 4-22 Layers Multilayer PCB Board High Speed PCB Prototype

Min. Hole Size: 0.2mm

Max. Panel Size: 600mm*1200mm

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2-layer High Frequency Printed Circuit Board Layer Count 100% Electrical Test Prior Shipment

Copper: 1oz

Test: 100% Electrical Test Prior Shipment

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Multilayer Interconnect System for Advanced Electronic Designs 3mil Min. Rogers 4330/5880，Panasonic MEGTRON

Min. Annular Ring: 3mil

Layer Count: Any Layer

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16 1 Vias Aspect Ratio HD SDI Converter for High Definition Video Conversion in Broadcast Industry

Silkscreen: White, Black, Yellow, Etc.

Pcb Assembly Process: SMT THT DIP SMT PCB Assembly

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White Silk HDI Printed Circuit Boards 0.4-3.2mm Thickness for Performance and Durability

Smallest Hole Size: 0.1mm

Min Via: 0.1mm

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1oz Finished Copper Thickness High Density Model Board with Immersion Silver Coated Surface Enhancement

Surface Mount Technology: Available

Thickness: 1.6mm, ±10%

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High Speed SMT THT DIP SMT PCB Assembly Process with High Density Interconnector Glass Epoxy Rogers Corp. PCB Board

Rogers RO4003+IT180 Mixture Rogers PCB Board 0.5-6oz Copper Immersion Gold Finish

Frequency R5880 Rogers PCB Board 100% Electrical Testing Various Surface Finished

100% Electrical Test Rogers PCB Board With Gold Finish 6 Layers RO4835+4350 Mixture

SMT THT DIP Assembly HDI PCB Board with Mini Holes 0.1mm and High Density Interconnector

±10% Thickness White Silkscreen HDI PCB Board for Density Interconnect Applications

100%E-Testing Glass Epoxy PCB Board with Blind And Buried Vias and Immersion Surface

Advanced SMT THT DIP SMT PCB Assembly with HDI PCB Board and Min. Solder Mask Bridge 0.075mm

Gold Finished 12 Layer PCB Board Black High Density Interconnect PCB With BGA

Surface Mount Technology Compatible HDI PCB Board with White Silkscreen and 1.6mm Thickness

Electronics Industry Multilayer PCB Board With Immersion Gold Surface

High Copper Weight Multilayer Pcbs 4-22 Layers Tg170 FR-4 Glass Epoxy 12OZ

Turnaround Any Layer HDI PCB With Minimum 3mil Line HASL / ENIG Surface Finish ROGERS+FR4

Panasonic M6 M8 FR-4 4-22 Layers Multilayer PCB Board High Speed PCB Prototype

2-layer High Frequency Printed Circuit Board Layer Count 100% Electrical Test Prior Shipment

Multilayer Interconnect System for Advanced Electronic Designs 3mil Min. Rogers 4330/5880，Panasonic MEGTRON

16 1 Vias Aspect Ratio HD SDI Converter for High Definition Video Conversion in Broadcast Industry

White Silk HDI Printed Circuit Boards 0.4-3.2mm Thickness for Performance and Durability

1oz Finished Copper Thickness High Density Model Board with Immersion Silver Coated Surface Enhancement