electronic circuit board (249) Online Manufacturer
Aspect Ratio: 10:1
Key Words: High Density Interconnector
Components: SMD, BGA, DIP, Etc.
Surface Finishing: HASL LF
Product Type: PCB Assembly
Bend Radius: 0.5-10mm
Hole Position Deviation: ±0.05mm
Bend Radius: 0.5-10mm
Bend Radius: 0.5-10mm
Product Type: PCB Assembly
No Of Layers: 4 Layer
Max Layer: 52L
Solder Mask Color: Green
Layers: 2
Copper Weight: 1oz
Rohs Compliance: Yes
Components: SMD, BGA, DIP, Etc.
Hole Position Deviation: ±0.05mm
Hole Position Deviation: ±0.05mm
Sanforized: Local High Density, Back Drill
Pcb Layer: 1-28layers
Product Type: PCB Assembly
Treatment: ENIG/OSP/Immersion Gold/Tin/Silver
Dimension: 41.55*131mm
Solder Mask Color: Green
Min. Trace Width/Spacing: 0.1mm
Minimum Trace Spacing: 0.1mm
Substrate Type: Rigid
Minimum Trace Spacing: 0.1mm
Substrate Type: Rigid
Max. Panel Size: 600mm*1200mm
Layers: 4-22 Layer
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