electronic circuit board (365) Online Manufacturer
Surface Mount Technology: Yes
Min. Hole Size: 0.2mm
Special Request: Half Hole, 0.25mm BGA
Min Trace: 3/3Mil
Board Layer: 6-32L
Hole Size: 0.1mm Laser Drill
Test: 100% Electrical Test Prior Shipment
Bga: 10MIL
Glass Epoxy: RO4730G3 0.762mm
Test: 100% Electrical Test Prior Shipment
Size: /
Surface: HASL、Immersion Gold、Immersion Tin、Immersion Silver、Gold Finger、OSP
Size: /
Copper Thickness: 0.5oz-6oz
Special Requirements: Multiclass Impedance
Number Of Layers: 4-32 Layers
Final Foil External: 1.oz
Surface Finishing: HASL/OSP/ENIG
Board Layer: 6-32L
Board Thickness: 0.2mm-6.00 Mm(8mil-126mil)
Raw Material: FR4 IT180
Layer Count: 4-20 Layers
Special Request: Half Hole, 0.25mm BGA
Impedance Control: Yes
Board Layer: 6-32L
Testing: 100%E-Testing,X-RAY
Mini Holes: 0.1mm
Min. Solder Mask Bridge: 0.075mm
Glass Epoxy: RO4730G3 0.762mm
Board Thickness: 0.78mm
Glass Epoxy: RO4730G3 0.762mm
Board Thickness: 0.78mm
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